Kerja Sepenuh Masa Technician – Dicing - Pick - Place | Semiconductor Manufacturing, Gaji tinggi MYR 5,000 di Globetronics Pulau Pinang - Maukerja

Employment Details

Position: Technician – Dicing & Pick & Place
Employment Type: Full-Time / Permanent
Industry: Semiconductor Manufacturing
Location: Bayan Lepas, Penang

Job Summary

We are looking for a Technician with hands-on experience in Dicing and Pick & Place processes within the semiconductor manufacturing industry. The successful candidate will be responsible for machine operation, setup, process monitoring, troubleshooting, and supporting production and engineering activities to ensure stable production and product quality.

Key Responsibilities

• Operate and monitor Dicing and Pick & Place machines according to work instructions and process specifications.
• Perform machine setup, product changeover, parameter adjustment, and first-piece verification.
• Monitor machine and process parameters during production.
• Perform wafer/die handling and ensure proper material identification and traceability.
• Conduct in-process inspection and identify process abnormalities or defects.
• Troubleshoot basic machine and process issues and escalate major problems to the Engineer or Equipment team.
• Perform routine machine cleaning, basic maintenance, and preventive maintenance activities.
• Support engineering trials, process qualification, NPI, and continuous improvement activities.
• Assist Engineers in process optimization and yield improvement.
• Maintain accurate production, process, and equipment records.
• Work closely with Production, Process Engineering, Equipment, and QA teams to resolve production and quality issues.
• Follow ESD, safety, 5S, cleanroom, and quality requirements at all times.

Requirements

• Certificate, Diploma, or Technical qualification in Electrical & Electronic, Mechanical, Mechatronics, Manufacturing Engineering, or related field.
• 1–3 years of relevant experience in semiconductor manufacturing is preferred.
• Hands-on experience in Dicing and/or Pick & Place processes.
• Familiar with semiconductor wafer/die handling and assembly processes.
• Able to perform basic machine troubleshooting and parameter adjustment.
• Able to understand work instructions, process specifications, and machine parameters.
• Good problem-solving and analytical skills.
• Able to work independently and as part of a team.
• Willing to work in a shift-based manufacturing environment.

Preferred Skills

• Dicing machine operation and setup.
• Pick & Place machine operation.
• Wafer and die handling experience.
• Semiconductor assembly process knowledge.
• Basic equipment troubleshooting and preventive maintenance.
• Process monitoring and quality inspection.
• Good teamwork, communication, and discipline.

Candidates with hands-on Dicing or Pick & Place experience are strongly encouraged to apply.

Job Type: Full-time

Pay: RM3,500.00 - RM5,000.00 per month

Benefits:

• Additional leave
• Dental insurance
• Flexible schedule
• Free parking
• Health insurance
• Maternity leave
• Opportunities for promotion
• Parental leave
• Professional development

Work Location: In person