ASE Electronics (M) Sdn. Bhd.

Design new package types and conduct feasibility study / Technical Gap Analysis.
Generate drawing leadframe, copper clip, package outline and strip outline.
Generate external bonding diagram. ...

Posted

a month ago

Review and Study new RFQ from Customer. 2. Work with customer on design requirements and capture design requirements in drawing. 3. Liaise with suppliers and internal PE team in terms of design drawing. 4. Generate Package Outline Drawing / Strip Outline Drawing / Bonding Diagram 5. VE / Cost down Project Management.

Posted

a month ago

Perform process improvement plan and sustaining activity to ensure process yield improve.
Machine maintenance and troubleshooting for any machine breakdown
Involved in regular engineering NPI activities for product, process & equipment qualification ...

Posted

a month ago

Develop, formulate, evaluate and execute process engineering in area of responsibility to improve yield, quality and productivity and cost.
Monitor, identifies, verifies analysis and give disposition to process related and technical concern of the product.
Conduct evaluation to characterize failure in terms of extent of damage and gives disposition on implications attribute to process handling materials defects or machine trouble. ...

Posted

a month ago

Develop, formulate, evaluate and execute process engineering in area of responsibility to improve yield, quality and productivity and cost.
Monitor, identifies, verifies analysis and give disposition to process related and technical concern of the product.
Conduct evaluation to characterize failure in terms of extent of damage and gives disposition on implications attribute to process handling materials defects or machine trouble. ...

Posted

a month ago

Hand on setup the equipment and process during engineering activities such as engineering evaluations.
Evaluation report compilation and initial data analysis.
Support Yield & Quality KPI improvement. ...