Full Time Yield analysis engineer Jobs, in FusionAP Pulau Pinang - Maukerja

Company Description FusionAP is a semiconductor engineering company founded by professionals with deep expertise in advanced packaging. The organization focuses on delivering world-class advanced packaging solutions to global customers while building Malaysia’s first high-value, next-generation packaging hub. FusionAP emphasizes innovation driven by engineering excellence and strategic partnerships. The company actively supports national priorities in AI, automotive, and high-performance computing, offering team members opportunities to work on impactful, cutting-edge technologies.

Role Description The Yield Analysis Engineer will work on-site in Batu Kawan Penang, Malaysia in a full-time capacity, focusing on monitoring, analyzing, and improving manufacturing yield for advanced semiconductor packaging processes. Day-to-day responsibilities include collecting and interpreting production and test data, identifying yield loss mechanisms, and performing failure analysis to determine root causes. The role involves designing and executing experiments, supporting process and test engineers with data-driven insights, and using simulations and statistical methods to validate corrective actions. The Yield Analysis Engineer will collaborate closely with cross-functional teams, prepare concise reports and dashboards, and contribute to continuous improvement initiatives that enhance product quality and manufacturing efficiency.

Qualifications

• Strong analytical skills and data analysis capabilities to interpret complex yield and process data.
• Experience with process engineering, failure analysis and testing in semiconductor manufacturing especially in SiP and FCxGA packaging environments.
• Ability to use simulations and modeling tools to evaluate process changes and predict yield impact.
• Knowledge of statistical process control, DOE (Design of Experiments), and root cause analysis methodologies.
• Bachelor’s degree or higher in Electrical Engineering, Electronics, Materials Science, Mechanical Engineering, or related field.
• Proficiency with data extraction, manipulation and analysis software (e.g., Excel, JMP, Python, R, or similar tools) is an advantage.
• Strong problem-solving skills, attention to detail, and ability to document findings clearly and accurately.
• Effective communication skills and ability to work collaboratively in cross-functional engineering teams.
• Experience in semiconductor packaging, wafer fabrication, or test operations is preferred.