Full Time Senior Thermal - Mechanical Engineer Jobs, in FusionAP Pulau Pinang - Maukerja

Senior Thermal & Mechanical Engineer – Advanced Semiconductor Packaging

Company Description

FusionAP is a Penang-based semiconductor company focused on establishing advanced packaging manufacturing capabilities, including 2.5D packaging, to serve global customers. Founded by experienced industry professionals, FusionAP brings together package engineering, assembly technology development and manufacturing expertise to support Malaysia’s growing advanced packaging ecosystem.

We work with manufacturing partners, equipment and material suppliers, and research organisations to build local technical competencies and translate engineering development into qualified manufacturing capability. Team members have the opportunity to establish new capabilities, develop local talent and contribute directly to the advancement of semiconductor packaging in Malaysia.

Role Description

This is a full-time, on-site role based in Penang, focused on thermal and mechanical engineering for semiconductor package assembly. The role will establish modeling and analysis capabilities that support assembly process development, equipment capability, package qualification and manufacturing improvement.

Working closely with platform architecture, process integration, assembly, equipment and reliability teams, the engineer will translate simulation and experimental findings into practical recommendations that improve assembly robustness, yield and reliability. The scope includes FCBGA technology development and extension into advanced packaging applications.

Key Responsibilities and Deliverables

• Dynamic warpage modeling: Develop and validate models of die, substrate and package deformation throughout assembly and customer SMT reflow. Assess temperature-dependent behaviour to identify warpage risks that may not be apparent at room temperature, and recommend improvements to protect assembly yield and solder-joint integrity.
• Mechanical design and tolerance analysis: Support mechanical design and establish tolerance budgets for package components, equipment, tooling and carriers. Evaluate dimensional variation, thermal deformation and mechanical loading to ensure adequate assembly margin and reduce downstream reliability risks.
• Assembly platform support: Apply thermal, mechanical and flow modeling—including underfill flow, heat transfer, cure effects and stress analysis—to guide material selection, process development and assembly platform qualification. Identify capability limits and recommend solutions for new package configurations.
• Model correlation and failure resolution: Correlate simulations with metrology, assembly yield and failure-analysis results. Refine models, identify dominant contributors and support experiments to validate corrective actions.
• Local capability development: Establish reusable modeling methodologies and share technical knowledge with local engineering teams. Collaborate with manufacturing partners, suppliers and research organisations to strengthen Malaysia’s advanced packaging ecosystem.

Qualifications

• Bachelor’s, Master’s, or PhD in Mechanical Engineering or a related discipline.
• Relevant experience in semiconductor packaging, electronics assembly or related thermal and mechanical engineering, with the ability to independently lead modeling and validation activities.
• Hands-on proficiency with FEA tools such as ANSYS, Abaqus or equivalent; experience with CFD or flow simulation is an advantage.
• Strong understanding of heat transfer, solid mechanics and temperature-dependent material behaviour.
• Experience in thermomechanical analysis, mechanical design and tolerance analysis; familiarity with package warpage and assembly tooling is preferred.
• Familiarity with flip-chip packaging materials, assembly processes and reliability considerations.
• Ability to develop and review CAD models and engineering drawings, including dimensional tolerances and GD&T.
• Experience correlating simulations with physical measurements and translating findings into practical engineering improvements.
• Strong analytical and communication skills, with the ability to collaborate with engineering teams, suppliers, manufacturing partners and customers.
• Experience with DOE, optimisation, scripting or automated simulation workflows is an advantage.