Company Description
FusionAP is a leading Malaysia-based advanced semiconductor packaging company focused on delivering innovative 2.5D, 3D, and next-generation packaging solutions. Through engineering excellence and strategic partnerships, FusionAP enables cutting-edge technologies for AI, high-performance computing (HPC), automotive, and other advanced semiconductor applications. We are building a world-class engineering team to develop and industrialize advanced packaging technologies that power the future of computing.
Role Description
We are seeking a hands-on Senior/Principal AMHS, OHT & Factory Automation Engineer to build the automation foundation of FusionAP's new advanced packaging plant. You will write the automation requirements into every equipment specification, design the AMHS/OHT system with the IE team, lead MES requirements and selection, and bring tools online with the MES during start-up. In a start-up, this role covers a broad scope, with a clear path to lead the CIM & Automation function as the plant scales.
Key Responsibilities
Equipment Automation Specification
- Define the factory automation standard for all equipment: SECS/GEM and GEM300 (SEMI E30/E37, E87, E90, E94), E84 load port handshake, carrier ID, wafer ID and data collection
- Write automation requirements into every tool RFQ, specification and PO, and review vendor compliance with the Equipment team and process owners
- Verify automation functions at FAT and SAT, and drive gaps to closure with vendors
AMHS & OHT Design and Implementation
- Work with the IE Lead on material flow and AMHS/OHT concept and simulation with vendors and consultants
- Define building provisions with the design team: ceiling height, OHT routing, floor loading, stocker and FOUP storage space
- Prepare AMHS specifications, run vendor evaluation, and lead installation, commissioning and acceptance
- Set up manual FOUP handling and carrier management for early production, ready to convert to OHT
MES & Equipment Integration
- Lead MES requirements and vendor selection with manufacturing, process, quality and finance (ERP interface)
- Work with the MES integrator on implementation; own equipment integration (EAP) and tool connection during start-up
- Plan lot and wafer traceability, recipe management and equipment data collection
Start-up Support & Team Growth
- Support tool hook-up and start-up hands-on for automation and connectivity issues
- Build automation standards, documentation and support procedures; help hire and train the automation team
Required Qualifications
- Degree in Electrical, Electronic, Mechatronics, Computer or Mechanical Engineering, or related
- 8+ years in semiconductor factory automation, preferably in a 300mm wafer fab
- Hands-on experience in AMHS/OHT design, installation or expansion (OHT, stockers, MCS)
- Strong knowledge of SECS/GEM, GEM300 and E84, including writing equipment automation specifications
- Experience with MES and equipment integration (EAP) in a volume manufacturing environment
- Proven track record in a fast-paced, rapid-ramp manufacturing environment
- Strong communication skills with vendors and cross-functional teams
Preferred Qualifications
- Experience in MES selection or implementation
- AMHS simulation experience (AutoMod or equivalent)
- Experience with dispatching (RTD), SPC/FDC or equipment data systems
- Experience in advanced packaging, wafer bumping or OSAT environments
- Scripting or programming skills (SQL, Python, C# or Java)
- Comfortable working hands-on in a start-up environment with ambiguity
Additional Information
- Reports to: COO (reporting line may evolve as the organization grows)
- Location: Northern Malaysia
- Travel: Short-trip travel to Belgium and supplier sites required
- Language: Fluent English (written and verbal); other languages a plus