Full Time Thermal, Mechanical Engineer Jobs, in Pride Global Pulau Pinang - Maukerja

Thermal, Mechanical Engineer

Employment type : Open to Perm & Contract

Working arrangement : Onsite

Location: Bayan Lepas, Penang

Salary Range : 15-20% Increment

Key Responsibilities

• Develop detailed thermal models (steady state and transient) for flip chip packages using tools such as Celsius, Flotherm, COMSOL, or Icepak to evaluate heat dissipation, junction temperature, and thermal cycling performance.
• Provide thermal solution to customer based on customer requirement.
• Perform finite element analysis (FEA) to assess CTE mismatch, solder bump fatigue, underfill behavior, and package warpage across assembly and operating conditions.
• Define bump layout, underfill selection, TIM, and heat spreader/heat sink integration to meet electrical, thermal, and mechanical requirements.

Required Qualifications

• Bachelor’s or Master’s degree in Mechanical, Mechatronics, Material Engineering, or related field with 3 to 7 years experience in thermal and mechanical design / validation
• Proficiency in thermal and mechanical FEA tools
• Knowledge of semiconductor packaging processes: bumping, reflow, underfill dispensing, molding, and substrate fabrication.
• Ability to interpret reliability data and correlate it with simulation results.
• Familiarity with DFM/DFR principles for packaging and advanced packaging.

If you are interested, please send your updated resume to ************* OR WA to +*************