Full Time Packaging Engineering Manager Jobs, in Power Integrations Pulau Pinang - Maukerja

Packaging Engineering Manager

Job Description

• Set up and manage the Package and Assembly development team in Asia.
• Work with internal engineering (New Product Definition, Quality and Reliability)and operations groups as well as suppliers (OSATs, Equipment and Material’s manufacturers) to define and deliver enabling innovative package technology for all market segments including automotive.
• Lead the design of proprietary packaging solutions to support our portfolio of products and ensure best in class electrical, mechanical, thermal and cost performance
• Concisely and effectively communicate strategic and tactical execution status to executive management and cross functional teams

Job Requirements

• BS Degree in Electrical Engineering, Mechanical Engineering, Material Science
• 12 years experience semiconductor packaging technology development
• 5 years in a managerial role
• Experience in leaded multi-die package
• Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation. (Flip Chip is a plus)
• Knowledge of AEQ Automotive reliability requirements.
• Knowledge of APQP automotive development process
• Knowledge of JEDEC/IPC design standards.
• Ability to work in a fast-paced, high stress environment with high rates of change
• Able to work with people in the US time zone