jobs in Chipbond Technology Malaysia

Full Time Equipment Engineer Jobs, in Chipbond Technology Malaysia Pulau Pinang - Maukerja

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Working Location

  • Pulau Pinang Malaysia

Job Description

Responsibilities


What you'll be doing


  1. Install, configure, and commission new equipment and systems
  2. Perform preventive and corrective maintenance on production equipment
  3. Diagnose and troubleshoot equipment issues to minimize downtime
  4. Collaborate with cross-functional teams to optimize equipment performance
  5. Develop and implement equipment improvement plans
  6. Maintain detailed records and documentation of equipment maintenance and repairs
  7. Provide technical support and training to production staff on equipment operation


What we're looking for


  1. Bachelor's degree in Mechanical/ Mechatronic/ Electrical and Electronic Engineering or a related technical field.
  2. At least 2 years of experience working as an Equipment Engineer in semiconductor environment; Experienced in managing machine related: photolithography/ Wafer Sort / Wafer Prober/ wafer sawing / taping / grinding / Laser marking/ Laser grooving/ Pick and Place/ Tape and Reel/ SMT/ Flip Clip/Die Bond/Die Attach/WireBond/Molding/AOI
  3. Fresh Graduate is encouraged to apply as well.


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