Define, develop, prove out, and deploy manufacturing processes for new products across the transceiver assembly flow (e.g., die attach, wire bond, active alignment, and general assembly), implementing continuous improvement projects to achieve yield, throughput, efficiency, scrap, and quality targets.
Lead manufacturing process development for new photonic products from prototype and engineering builds through NPI qualification and volume production.
Technology strategy and leadership: Define and deliver the roadmap, standards, and investment priorities for quantum processor fabrication, packaging, assembly, and test.
Technology strategy and leadership: Define and deliver the roadmap, standards, and investment priorities for quantum processor fabrication, packaging, assembly, and test.