Global Program Management: Independently lead and coordinate global Best Cost Country and localization projects from initial planning to successful factory implementation.
Lead package engineering development for Substrate-Based Power Modules, Flip-Chip, Multi-Chip Modules (MCM), and System-in-Package (SiP) architectures targeting AI acceleration and data center applications.
Support daily production issues at test floor and wafer probe. This includes low yield analysis and disposition, and setup failure debug/analysis and resolution (both hardware and software)
Govern, execute, and sustain technical engineering competency development initiatives to build and maintain a competent workforce aligned with organizational targets.
Plan and schedule Preventive and Proactive Maintenance activities, with overall responsibility for equipment reliability, availability and maintainability