Process Ownership & Support Own and support assigned manufacturing processes. Monitor process performance, yield, quality, and productivity metrics. Provide daily technical support to manufacturing operations.
Process Ownership & support own and support assigned manufacturing processes. Monitor process performance, yield, quality, and productivity metrics. Provide daily technical support to manufacturing operations.
Process Ownership & Support Own and support assigned manufacturing processes. Monitor process performance, yield, quality, and productivity metrics. Provide daily technical support to manufacturing operations.
Own and manage all Die Bond process technologies, including epoxy die attach, Eutectic die bond process, and advanced die attach processes as applicable.
Develop, characterize, qualify, and optimize die attach processes for PIC/silicon photonics dies, laser dies, and EIC-PIC hybrid assemblies, including active/passive alignment epoxy attach, AuSn/eutectic solder attach, and flip-chip bonding.
MES Implementation (Project Phase): Represent Die Prep equipment engineering in the MES rollout. Define workflows, setup/recipe controls, and equipment states.
Process Ownership & Support Own and support assigned manufacturing processes. Monitor process performance, yield, quality, and productivity metrics. Provide daily technical support to manufacturing operations.
Own and manage all Die Bond process technologies, including epoxy die attach, Eutectic die bond process, and advanced die attach processes as applicable.