Technical foundation in manufacturing or mechanical engineering, preferably with experience in machinery, equipment, or industrial automation environments.
Ability to read and interpret technical drawings, process documentation, and basic CNC or fabrication specifications.
Knowledge of manufacturing processes such as machining, sheet metal fabrication, stamping, and assembly operations.
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Perform Incoming (IQC), In-Process (IPQC), Final (FQC), Outgoing (OQA), and reliability inspections in accordance with inspection plans, specifications, and customer requirements.
Conduct visual, dimensional, functional, and workmanship inspections using approved measuring equipment, inspection methods, and applicable IPC standards.
Verify product compliance with engineering drawings, BOM, specifications, customer requirements, and workmanship standards.
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Strong foundation in mechatronics, mechanical engineering, electrical engineering, or related field, with knowledge of mechanical design, electronics, and control systems.
Proficiency in CAD software (e.g., SolidWorks, AutoCAD) and basic exposure to PLCs, sensors, actuators, and automation components.
Ability to read and interpret engineering drawings, schematics, and technical documentation, and to prepare clear reports and documentation.
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You will serve as a specialist in finite element simulation at AT&S.
You will be responsible for executing thermo-mechanical simulations related to warpage, reliability, failure analysis, and thermal management.
You will continuously improve simulation processes, validate results, and act as a key interface with production and the material testing team to achieve set targets.
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Lead a group of shift Supervisor to ensure the daily WIP Turn Ratio (WTR) are being achieved with the MOVES target achievement set by line steering at wafer fab bottleneck tools/ processes
Involvement in any misprocess or handling issue incidents investigation related to human handling
Liaise with Production Control on capacity and loading issues to achieve optimum capacity utilization. Initiate and manage productivity improvement project
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Perform Discrete Devices and PCM Failure Analysis [FA] on wafer and package level from electrical verification, fault isolation and physical root cause analysis.
Prepare FA reports that can lead to root cause finding and corrective action to cross functional team.
Participate and present FA results in cross functional meetings and yield improvement.
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Develop, qualify, and optimize wafer fabrication processes for Insulated Gate Bipolar Transistor (IGBT) technologies to support high-reliability power semiconductor applications in industrial and energy systems.
Establish and improve process flows, materials, and methodologies to meet product performance, quality, and cost targets in line with Fuji Electric manufacturing standards.
Demonstrate strong support of wafer process integration, including key modules such as oxidation, lithography, ion implantation, diffusion, etching, thin film deposition, and metallization, with focus on IGBT device characteristics.
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Collaborates with Customers throughout all stages of validation projects to establish cycle process parameters in compliance with ISO 11135. Coordinates validation cycles and reviews and approves validation protocols, reports, and CSPs within agreed timelines.
Liaises with quality, operations, planning, laboratory, and customer service teams to coordinate and complete customer validation projects.
Prepares for, supports, and facilitates internal and external audits by Customers, notified bodies, and Regulatory Agencies. Implements corrective actions for assigned audit findings.
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