Design, implement, and manage enterprise networking components like IP network subnets, LAN/WAN/Wireless, firewalls, load balancers, Meraki and VPN gateways
Deploy, managing and monitor network resources through global Infrastructure
Plan and execute data center & office network migrations, deployments and optimizations to enhance performance and scalability.
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Work together with Product Engineering team and manufacturing test engineering team to support new product development and its smooth transition to mass production in multiple manufacturing sites.
Develop and implement test software & hardware for high voltage, high power semiconductor module and discrete, primarily in the area of final test
Develop test coverage to ensure no test escapees
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Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.
Develop and implement process improvements to enhance yield, reliability, and throughput. Troubleshoot, Disposition and resolve equipment and process issues in a fast-paced production environment.
Collaborate with design, quality, and manufacturing teams to support new product introductions.
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Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation plans using MTBF/MTBA analysis; evaluate the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during product development and qualification to ensure molding equipment readiness for high-volume manufacturing (HVM).
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Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation plans using MTBF/MTBA analysis; evaluate the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during product development and qualification to ensure molding equipment readiness for high-volume manufacturing (HVM).
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Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation plans using MTBF/MTBA analysis; evaluate the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during product development and qualification to ensure molding equipment readiness for high-volume manufacturing (HVM).
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Perform general and specific preventive and corrective maintenance on semiconductor manufacturing equipment. Requires the use of diagnostic equipment and procedures to maintain and repair production equipment. Majority of work is conducted in a cleanroom environment requiring the wearing of specific clothing to be worn over regular clothing.
Participate in continuous improvement activities.
Participate as part of a team or independently in identifying and solving problems
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Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.
D&I Statement
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
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Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
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Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
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