Operate and optimize die location inspection systems (e.g., automated optical inspection, die sorters, or alignment tools) by defining and tuning inspection recipes to ensure precise die coordinate verification and defect placement accuracy.
Perform routine process monitoring and troubleshooting, including tool qualification, SPC tracking for alignment parameters, and image-based defect analysis, to maintain stable and repeatable die location accuracy.
Analyze die location and metrology data to identify misregistration trends, conduct root‑cause analysis, and implement corrective and preventive actions (CAPA) to enhance yield, throughput, and process stability.
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