Lead the architecture, design, and development of advanced packaging solutions, including FOWLP, 2.5D/3D IC integration, CoWoS, EMIB, and hybrid bonding technologies.
Define, document, and enforce Emerson AI governance policies, ethical guidelines, compliance expectations, and approval standards for Salesforce AI capabilities, including Agentforce and Einstein
To lead technically in ASIC design implementation domain, which may include stages from design architectural understanding till timing signoff for tapeout
To lead technically in ASIC design implementation domain, which may include stages from design architectural understanding till timing signoff for tapeout
To lead technically in ASIC design implementation domain, which may include stages from design architectural understanding till timing signoff for tapeout
To lead technically in ASIC design implementation domain, which may include stages from design architectural understanding till timing signoff for tapeout