As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.
The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques.
The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.
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Conduct comprehensive commonality analyses across product design, processes, machinery, materials, and measurement methodologies. Facilitate cross-functional collaboration to execute Root Cause Corrective Action (RCCA) initiatives with maximum efficacy.
Design and implement rigorous engineering Design of Experiments (DOEs) and apply advanced statistical analysis methods for complex problem-solving and data-driven decision-making processes.
Execute thorough factory Design for Mechanical Assembly and Automation (DFMA) evaluations for Solid-State Drive (SSD) assembly through meticulous examination of Design Packages, including design concepts, tolerance stack-up analyses, and Design Failure Mode and Effects Analysis (DFMEA). Actively participate in the design of machines and fixtures to enable optimal process performance.
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