We are seeking a highly driven and technically strong Plating Process Engineer to lead sustaining and continuous enhancement initiatives across semiconductor packaging operations. This role plays a critical part in ensuring plating process stability, yield improvement, and high equipment performance to support advanced and high-volume manufacturing (HVM).
You will work closely with cross-functional teams including Equipment Engineering, R&D, NPI, Product Design, and Reliability to ensure plating capabilities meet evolving package architecture and technology requirements.
Lead and manage sustaining activities and continuous improvement of plating processes across multiple semiconductor package platforms.
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Lead and manage sustaining activities and continuous improvement of plating processes across multiple semiconductor package platforms.
Conduct routine process capability and performance evaluations to ensure alignment with manufacturing standards.
Identify sources of process variation and yield loss; drive corrective and preventive actions to improve in-line practices, lot-on-hold (LOH) management, and overall process capability.
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To perform molding equipment maintenance, molding process and improvements which are to be attained through practical use of statistical tool methods, data extraction and analysis.
To conduct machine life span studies and equipment maintenance cost reduction.
Ownership on operational indicators such as safety, machine OEE,UPH, MTBA line yield and machine defect reduction.
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Provide effective and efficient technical support to the site in troubleshooting, optimization, and ensuring safe plant operation.
Monitor plant performance against approved targets on a day-to-day basis, identify existing or potential technical issues, and respond proactively to risks and threats.
Identify and implement specific projects to improve plant safety, reliability, integrity, efficiency, operability, capacity, and overall margin.
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Provide effective and efficient technical support to the site in troubleshooting, optimization, and ensuring safe plant operation.
Monitor plant performance against approved targets on a day-to-day basis, identify existing or potential technical issues, and respond proactively to risks and threats.
Identify and implement specific projects to improve plant safety, reliability, integrity, efficiency, operability, capacity, and overall margin.
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Yield & Defect Analysis: Develop and maintain ML models to identify root causes of package failures (e.g., wire sweep, voiding, or delamination) using sensor and metrology data.
CV for Automated Inspection: Enhance and deploy Computer Vision (CNN-based) models for Automated Optical Inspection (AOI) to reduce "False Calls" and "Escapes" on the production line.
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Yield & Defect Analysis: Develop and maintain ML models to identify root causes of package failures (e.g., wire sweep, voiding, or delamination) using sensor and metrology data.
CV for Automated Inspection: Enhance and deploy Computer Vision (CNN-based) models for Automated Optical Inspection (AOI) to reduce "False Calls" and "Escapes" on the production line.
Production Deployment: Transition models from local environments (Jupyter/Python) into the factory’s execution system using Docker and REST APIs.
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Serve as the principal technical expert for wafer backgrind, thinning, and metallization processes in preparation for die assembly and final test.
Provide deep technical guidance across wafer fabrication, back‑end assembly and packaging, final electrical testing, and reliability qualification.
Support yield learning, defect reduction, and root cause investigations using semiconductor failure analysis techniques, advanced data analytics, and pattern recognition approaches.
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As a Senior Engineer (Molding), you will be responsible for ensuring the reliability, performance, and continuous improvement of molding equipment in a high-volume semiconductor manufacturing environment. This role plays a critical part in supporting new product introductions, driving yield and uptime improvements, and enabling advanced packaging technologies. You will work closely with cross-functional teams including Process Engineering, R&D, NPI, and Product Design.What You Will Do
Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types.
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We are seeking a Senior Die Bond Equipment & Process Engineer to join our semiconductor manufacturing team. In this role, you will take ownership of die bond equipment, including buyoff machines, and processes to ensure high-quality, reliable, and efficient production. You will collaborate with R&D, manufacturing, and process teams to support new product introductions, troubleshoot equipment issues, and drive continuous process improvements.
What You Will Do:
Lead the setup, qualification, and optimization of die bond equipment, including buyoff machines.
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We are seeking a Senior Wire Bond Equipment & Process Engineer to join our dynamic team. In this role, you will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production. You will work closely with cross-functional teams, including R&D, process engineering, and manufacturing, to drive continuous improvement and innovation.
Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.
Develop and implement process improvements to enhance yield, reliability, and throughput.
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BG Partnership: Serve as the primary strategic partner to Business Groups (BG) during the product architectural phase to ensure Design for Excellence (DFX) and seamless technology transfer.
Operational Readiness: Direct the team in executing complex qualifications, ensuring all products meet the "Gold Standard" of being Capable, Stable, and Manufacturable ($C_{pk} \geq 1.67$, zero-defect reliability, and optimized OEE).
Handshake Governance: Define and enforce the global "Handshake" protocols between R&D and Operations to eliminate friction during mass production ramps.
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The Director of CPE & NPI is a high-impact leadership role responsible for the end-to-end industrialization strategy of Assembly and Final Test (FT) technologies. This individual will lead a multidisciplinary organization of ~50 personnel, overseeing the seamless transition of new products from concept to high-volume manufacturing (HVM) while aggressively optimizing the Value Added (MVA) through strategic BOM engineering.