The Director of CPE & NPI is a high-impact leadership role responsible for the end-to-end industrialization strategy of Assembly and Final Test (FT) technologies. This individual will lead a multidisciplinary organization of ~50 personnel, overseeing the seamless transition of new products from concept to high-volume manufacturing (HVM) while aggressively optimizing the Value Added (MVA) through strategic BOM engineering.
As a Process Development Engineer (WB), you will develop and optimize semiconductor assembly processes to meet project Functional Requirement Specifications (FRS), ensuring robust manufacturability, reliability, and high-quality output for new products and platforms.
What You Will Do
Develop and characterize new semiconductor process technologies, applying structured engineering methods such as DOE, SPC, FMEA, and Six Sigma
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Strong understanding of slitting, rewinding, and related converting processes, with the ability to set up and optimize slitting equipment safely and efficiently.
Basic mechanical and technical aptitude, including the ability to perform routine machine checks, identify issues, and support maintenance personnel with troubleshooting.
Familiarity with production planning, quality control procedures, and documentation within a manufacturing environment, ideally in packaging, films, paper, or release liner production.
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Own and manage the wafer dry etch process, ensuring stable performance and continuous improvement.
Provide technical leadership and timely solutions for day‑to‑day manufacturing issues.
Optimize wafer fab processes using Design of Experiments (DOE), statistical analysis, and data‑driven methodologies to improve yield, cost, quality, and cycle time.
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Own and manage the wafer dry etch process, ensuring stable performance and continuous improvement.
Provide technical leadership and timely solutions for day‑to‑day manufacturing issues.
Optimize wafer fab processes using Design of Experiments (DOE), statistical analysis, and data‑driven methodologies to improve yield, cost, quality, and cycle time.
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As a Die / Clip Attach Technical Expert, you will be responsible for developing and implementing competitive technical solutions across semiconductor manufacturing processes, including Pre-Assembly, Die Bond, Wire Bond, Mold, and related areas.
This role requires strong technical expertise, project leadership, and close collaboration with cross-functional and international teams to support factory objectives and future package R&D roadmaps.What You Will Do
Using key metrics and your own fab knowledge, you monitor the health of the Fab and redirect priorities as needed. You must become an expert at interpreting these metrics.
Escalate Safety observations to appropriate stakeholders for resolution. Ensure that issues are followed through to closure.
Identify and escalate production impactors to ensure the even and efficient flow of our production line.
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