Hands-on in operating Pilot Plant process/fill/pack run to achieve target output (prototype trial, commercial run). This includes ensuring manpower/equipment/material readiness, site GMP, operation SOP adherence, food safety compliance, etc.
Based in Singapore, the regional hub for Asia Pacific (AP) and top-ranked biopharmaceutical company on the Straits Times and Statista’s list of Best Employers in Singapore for two consecutive years (2020, 2021).
Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.
In charge of supporting the end-to-end engineering development for Metal processes, including wax pattern injection, shell coating and mold preparation, alloy melting, pouring and solidification control, CNC machining interface requirements, heat treatment, NDT, and dimensional validation.
Lead Engineers to set-up metrology recipe of newly introduced processes or new metrology/ process equipment or tools. Evaluate the new measurement processes and make a series of measurement characterization.
Provide on-site process engineering support for plasma etch, clean and deposition equipment, including new system installations, start-up and process qualification at customer facilities.
Responsible for silicon photonic wafer backside grinding/thinning process, laser stealth dicing process and die sorting development for silicon photonic chips, with OSAT or internal line.