Responsible for the planning and/or execution of laboratory-based experiments or pilot-based campaigns in support of process development, design and scale-up
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Manage a cost-effective manufacturing process procedure in wafer fabrication, through the provision of operations support to the production line, so as to achieve organization's targeted manufacturing index. Take full ownership on all operational issues of assigned process
More than 8 years of front-end semiconductor wafer fabrication equipment working experience, competency in manufacturing, process engineering, product or process development.
Participates on services and calibrates test equipment by making regular performance inspections, planning preventative maintenance and repairing defective equipment or systems.
Responsible for silicon photonic wafer backside grinding/thinning process, laser stealth dicing process and die sorting development for silicon photonic chips, with OSAT or internal line.
Job ComplexityWorks on assignments that are generally standard in nature.Applies working knowledge of technical resources to complete assigned tasks.Identifies and solves basic problems and presents alternatives in a useful/logical manner.