Own and continuously improve calibration and test processes for products, including performance metrics such as First Pass Yield (FPY), repeatability, reproducibility, cycle time, and compliance with product performance and quality requirements.
Provide technical support and troubleshooting for production-related calibration issues.
Develop, maintain, and improve calibration procedures, work instructions, and process documentation.
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Plan, execute, and support thermal validation testing for electronic products and systems.
Perform thermal measurements using equipment such as temperature data loggers, infrared (IR) cameras, wind tunnels, and other thermal testing instruments.
Validate and optimize fan speed control algorithms and over-temperature protection mechanisms.
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Serve as the Package Engineering representative on cross functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements.
Provide end to end ownership of the package lifecycle across design, development, qualification, and manufacturing, driving alignment among cross functional engineering teams, global factories, and key stakeholders.
Lead global engagement with factories and contract manufacturers to enable robust, scalable, and cost effective high volume introduction of new package designs and advanced assembly processes.
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Processor silicon DDR interface feature enablement, electrical test and debug engineer. In this role, this senior level engineer will be part of a highly technical team that develops test plans, executes bring-up & feature enable, & debugs electrical issues in the memory sub-system of new processors.