Handle installation, commissioning, relocation and servicing of semiconductor manufacturing equipment, with hands-on exposure to etch, clean or deposition systems at customer sites.
Handle installation, commissioning, relocation and servicing of semiconductor manufacturing equipment, with hands-on exposure to etch, clean or deposition systems at customer sites.
Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.
Lead engineering teams to design and develop semiconductor equipment modules, ensuring integration into full machines through structured design reviews, comprehensive documentation, and thorough issue investigations.
Lead the development, optimization, and qualificationof III-V epitaxial growth processes (primarily MOCVD) for various device structures to meet R&D and production requirements.
Provide on-site process engineering support for plasma etch, clean and deposition equipment, including new system installations, start-up and process qualification at customer facilities.