Perform preventive maintenance (PM) on semiconductor manufacturing equipment in accordance with established procedures.
Support installation, replacement, and servicing of machinery components, including handling of heavy equipment parts with proper care and safety measures.
Assist in minor and major PM activities, including tube cleaning, heater replacement, and related maintenance logistics support.
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Lead the process development and technical support of the wafer bumping, and/or Fan-Out process for silicon photonic chip wafers, with OSAT or at internal line.
Process Pathfinding & Integration: Design and optimize early-stage process flows for wafer bumping, thin-film sputtering, lithography, electroplating, and ball drop execution. DOE to characterize process window and margin.
Material Characterization & Selection: Evaluate and qualify new manufacturing raw materials, including dielectric photoresists, plating chemistries, underfills, and solder alloys.
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Lead the process development and technical support of the wafer bumping, and/or Fan-Out process for silicon photonic chip wafers, with OSAT or at internal line.
Process Pathfinding & Integration: Design and optimize early-stage process flows for wafer bumping, thin-film sputtering, lithography, electroplating, and ball drop execution. DOE to characterize process window and margin.
Material Characterization & Selection: Evaluate and qualify new manufacturing raw materials, including dielectric photoresists, plating chemistries, underfills, and solder alloys.
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Works on assignments with clearly defined objectives using standard procedures and tools
Delivers own output under close supervision and guidance
Solves problems which require knowledge of specific processes and procedures Works on assignments that are routine in nature, requiring limited judgment. Has little or no role in decision-making.
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