Key Responsibilities
- Lead and support technology development and process improvement projects.
- Act as the technical contact for customers and internal teams.
- Conduct feasibility studies and identify technology gaps.
- Coordinate project timelines, resources, risks, and deliverables.
- Support development of new PCB, substrate, and advanced packaging technologies.
- Work with cross-functional teams to implement new technologies and solutions.
- Support customer meetings, technical discussions, and project updates.
- Contribute to technology roadmaps and continuous improvement initiatives.
Requirements
- Bachelor's Degree or higher in Engineering, Science, or related fields.
- Minimum 5 years of experience in Technology Development, R&D, Process Engineering, Project Engineering, or related technical roles.
- Experience in PCB, IC Substrate, Semiconductor, Advanced Packaging, or Electronics Manufacturing is preferred.
- Strong knowledge of manufacturing/process development and problem-solving.
- Experience in customer-facing projects and cross-functional project management is an advantage.
- Knowledge of DOE, QbD, QRM, and Commonality Analysis is an advantage.
Preferred Experience – PCB Plating
Candidates with strong PCB plating experience are highly encouraged to apply, especially in:
- ENIG / ENEPIG
- Electrolytic & Electroless Copper Plating
- mSAP / SAP
- Panel / Vertical / Horizontal Plating
- Pattern Plating
- Desmear & Metallization
- Plating Chemistry & Process Control
Pay: RM5,000.00 - RM11,000.00 per month
Work Location: In person