Kerja Sepenuh Masa R - D Engineer – Underfill-Cure, Gaji tinggi SGD 4,500 di STATS CHIPPAC MANAGEMENT PTE. LTD. North Region (Singapore) - Maukerja

About the role

To design, qualify, and optimize advanced underfill processes (e.g., CUF, MUF, NCF/NCP) that meet strict design rules and high-density packaging requirements, ensuring stable, cost-effective, and scalable technology delivery according to the technology roadmap.

Key responsibilities

• Advanced Underfill Process development for CoWoS PKG product family and CPO

• Dispensing & Material Evaluation / Qualification

• Void & Fillet Control

• Failure Analysis & Reliability Enhancement

• Customer Development & Technology Transfer

• Lead assigned projects

• Yield Improvement & Yield Failure Analysis (FA)

About you

• Bachelor's degree or higher in engineering or science (e.g., Material Science, Chemistry, Chemical Engineering, Electronics, Advanced Materials, etc.)

• R&D or mass production experience of at least three years in Underfill processes (e.g., CUF, MUF, NCF/NCP), dispensing, or encapsulation technology

• Proven experience in driving customer development programs (e.g., JDP, customer qualification, technical evaluations) and managing customer requirements

• Fundamental understanding of advanced semiconductor packaging processes, underfill fluid dynamics, void-free encapsulation, and thermal-mechanical stress control

• Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting

• Ability to prepare technical documents and deliver presentations to internal and external stakeholders

• Proficiency in reading and writing technical documents in English

• Basic knowledge of underfill equipment (dispenser, cure oven), epoxy/resin materials, and inspection/reliability characterization tools