- Senai Johor Malaysia
Lokasi Kerja
Penerangan Kerja
Tanggungjawab
Responsibilities :
• Prepare and optimize production data for PCB Assembly, ensuring efficient and high-quality output.
• Create and maintain detailed production routings in SAP and Spectrum Pro (SP2), optimizing the material and product flow.
• Develop clear and concise PCB assembly instructions, considering the requirements and capabilities of the production.
• Manage stencil optimization and inventory, ensuring timely delivery and optimal use.
• Oversee the launch of new products, creating all necessary documentation and coordinating with cross-functional teams.
• Manage product changes and version control, ensuring all relevant parties are informed.
• Collaborate closely with production and product development teams, providing technical expertise and support, and fostering a strong team environment.
• Preparing NPI for new models and Design for Manufacturing (DFM).
• Preventing and eliminating process defects and maintaining quality levels
• Liaise with the departments and work together (I.E, Quality and Product Engineering) during new product introductions (NPI) stage
• Design and fabricate jig and fixtures and register into system.
• Documentation new equipment and other capital requirement to meet customer demand and maintaining the company’s technology level in line with Industrial trends.
• Perform process validation from front to end PCB assembly process
• Propose to superior suitable process or machine for manufacturing process.
• Responsible to up the machine if machine break-down or follow-up with supplier.
• Participating in all meeting as required. Exp. SCAR meeting, FA run, FMEA.
• Supervise Technician and Repairer.
• Assist Manager to do data analysis, capability studies on machine and product.
Requirements :
• Degree in Electrical/Electronics/Mechanical Engineering
• 8-10 years of working experience in EMS environment.
• Trained and understand ISO working procedures.
• Familiar engineering documentation BOM/ECN implementation.
• In-depth knowledge and understanding of the design process for systems and printed circuit boards, subassemblies, or other related company products
• In-depth knowledge of manufacturing processes and equipment used for systems and printed circuit boards and subassemblies
• In-depth knowledge of industry and quality standards and SPC methodologies
• In-depth knowledge of materials and components used in the construction of systems and printed circuit boards and subassemblies.
• 3-5 years people management skills, Systematic job load assignments to subordinate
Peringatan Penting
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