- Cyberjaya Selangor Malaysia
Lokasi Kerja
Penerangan Kerja
Tanggungjawab
About ASEM
ASEM (Advanced Semiconductor Academy of Malaysia) is based out of Malaysia Semiconductor IC Design Park II, is dedicated to developing next-generation semiconductor talent and translating applied research into commercial silicon. Its thematic focus includes AI accelerators, custom silicon for edge and physical AI, advanced SoC architectures, chiplets and heterogeneous integration, and low-power, high-performance IC design.
About MSRD
Malaysia Semiconductor Recruitment Day (MSRD) 2026 brings together 70+ semiconductor companies, 1,000+ job opportunities, and 40+ industry speakers under one platform, connecting talents with employers across the semiconductor industry in KLCC on 14-17 Oct 2026.
Ahead of the event, we are featuring selected openings from participating employers to help candidates discover available opportunities and identify roles that match their experience and career interests. Submit your resume for relevant opportunities, and join us at MSRD 2026 to meet participating employers and explore more career openings.
Job title: Senior Packaging Engineer
Years of Experience: 3 to 8
Talent Category: Senior
Type of Employment: Full Time
Job Description:
ESSENTIAL DUTIES AND RESPONSIBILITIES:
• Conduct comprehensive commonality analyses across product design, processes, machinery, materials, and measurement methodologies. Facilitate cross-functional collaboration to execute Root Cause Corrective Action (RCCA) initiatives with maximum efficacy.
• Design and implement rigorous engineering Design of Experiments (DOEs) and apply advanced statistical analysis methods for complex problem-solving and data-driven decision-making processes.
• Execute thorough factory Design for Mechanical Assembly and Automation (DFMA) evaluations for Solid-State Drive (SSD) assembly through meticulous examination of Design Packages, including design concepts, tolerance stack-up analyses, and Design Failure Mode and Effects Analysis (DFMEA). Actively participate in the design of machines and fixtures to enable optimal process performance.
• Design SSD (Solid-State Drive) assembly jigs / fixtures by developing new concepts, performing reverse engineering, and creating mechanical drawings to support daily mechanical assembly and technical staging activities.
• Oversee the development and implementation of comprehensive Product Qualification Packages during the development phase, encompassing product specifications, packaging requirements, mechanical drawings, supplier Design for Manufacturability (DFM) guidelines, and Quality Management Plans (QMP) for each qualified product.
• Spearhead specialized engineering characterization activities, lead strategic cost reduction projects, and provide critical support for factory emergency taskforce operations as required.
Qualifications
REQUIRED:
• Bachelor's Degree in Mechanical Engineering or related disciplines is mandatory. Academic studies must be in an applicable field of engineering or science, demonstrating a record of scholastic excellence.
• Candidates with 3-8 years of professional experience in an engineering role within the semiconductor and automation industry will be given preferential consideration.
• Proven ability to swiftly analyze and resolve complex engineering challenges through innovative approaches, demonstrating a clear understanding of efficiency and resource optimization.
• Exceptional skill in synthesizing and presenting complex design concepts and data sets to both technical and non-technical audiences, with particular expertise in designing and executing Design of Experiments (DOE).
• Exceptional verbal and written communication skills are essential for success in this role.
PREFERRED:
• Comprehensive understanding of common mechanical commodities used in the semiconductor industry, including metals, plastics, rubbers, and adhesives is highly desirable.
• In-depth knowledge of manufacturing processes and tooling construction for mechanical commodities, including but not limited to CNC milling, stamping, bending, injection molding, die casting, and extrusion, will be viewed favorably.
• Superior self-motivation and self-direction, coupled with a demonstrated capacity for effective teamwork and strong intercultural competence.
SKILLS:
• Advanced proficiency in quality management tools (FMEA, 8D, DMAIC) and statistical analysis software (JMP, Minitab).
• Expert-level proficiency in SolidWorks CAD software is required. Familiarity with SolidWorks Flow Simulation is a significant advantage.
• Extensive hands-on experience with technical equipment and processes, including advanced metrology and failure analysis techniques.
Disclaimer
By submitting your application/resume through ASEM / MSRD 2026, you acknowledge and agree that your information may be shared with relevant participating employer(s) for recruitment and candidate consideration purposes. Submission of your application does not guarantee an interview, selection, or employment offer. Final recruitment decisions are made solely by the respective employer(s).
Peringatan Penting
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