- Pulau Pinang Malaysia
Kerja Sepenuh Masa, Wire Bond Engineer di Renesas Semiconductor KL Pulau Pinang - Maukerja
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Tanggungjawab
Company Description RENESAS Semiconductor KL Sdn Bhd, a subsidiary of the Renesas Electronics Group, is a leading global semiconductor manufacturing company established in 1974 and located in Telok Panglima Garang, Selangor. The company produces high-quality semiconductor products such as integrated circuits, transistors, and diodes used in a wide range of industrial and consumer applications. Renesas is recognized for its technology expertise in microcontrollers, system LSI devices, and analog and power devices, holding a top market position in MCUs. The organization is committed to customer satisfaction through quality, competitive cost, and on-time delivery, while investing in technical innovation and comprehensive employee training. Renesas aims to create a future where people prosper in harmony by continuously improving its manufacturing capabilities and workforce skills.
Role Description The Wire Bond Engineer is a full-time, on-site role based in Penang, Malaysia, responsible for optimizing and supporting wire bonding processes for semiconductor device assembly. Day-to-day tasks include developing and maintaining wire bond parameters, monitoring production performance, and troubleshooting process issues to ensure product quality and yield. The role involves collaborating with equipment engineering to set up, qualify, and maintain wire bond machines, as well as driving continuous improvement projects related to productivity, cost, and reliability. The Wire Bond Engineer will analyze process data, conduct experiments, and prepare technical documentation and reports for cross-functional teams. The position also requires close coordination with quality, product, and manufacturing teams to meet customer specifications and support new product introductions.
Qualifications
Role Description The Wire Bond Engineer is a full-time, on-site role based in Penang, Malaysia, responsible for optimizing and supporting wire bonding processes for semiconductor device assembly. Day-to-day tasks include developing and maintaining wire bond parameters, monitoring production performance, and troubleshooting process issues to ensure product quality and yield. The role involves collaborating with equipment engineering to set up, qualify, and maintain wire bond machines, as well as driving continuous improvement projects related to productivity, cost, and reliability. The Wire Bond Engineer will analyze process data, conduct experiments, and prepare technical documentation and reports for cross-functional teams. The position also requires close coordination with quality, product, and manufacturing teams to meet customer specifications and support new product introductions.
Qualifications
- Strong foundation in Electrical Engineering, including knowledge of Electricity and Power Systems.
- Proficiency in Electrical Design related to semiconductor packaging or manufacturing processes.
- Understanding of Power Distribution concepts as they relate to device performance and reliability.
- Bachelor’s degree in Electrical/Electronic Engineering, Materials Science, or a related technical field.
- Experience with wire bonding equipment, semiconductor assembly processes, or similar manufacturing environments is an advantage.
- Ability to analyze data, run experiments, and apply structured problem-solving and root-cause analysis.
- Strong communication skills and the ability to work effectively with cross-functional teams on-site.
- Willingness to support shift or extended hours when required by production or project needs.
Peringatan Penting
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