Lead, direct, and optimize the wet chemistry and plating manufacturing operations. This role is responsible for driving production yields, managing capital expenditure projects, and leading a high-performing engineering and technical team to meet stringent technology roadmaps and high-volume manufacturing demands.
Responsibilities:
1. Operations & Yield Management
- Drive KPIs: Maximize line throughput, minimize scrap rates, and maintain world-class First-Time-Right (FTR) quality yields.
- Process Optimization: Oversee the performance of automated horizontal and vertical continuous plating lines.
- Statistical Controls: Implement rigorous Statistical Process Control (SPC) and Design of Experiments (DOE) to minimize process variations.
- Troubleshooting: Serve as the final technical authority for resolving complex plating defects (e.g., micro-voids, thickness non-uniformity, delamination).
2. Strategic Leadership & Capital Projects (CAPEX)
- Line Expansion: Lead the installation, qualification, and commissioning of new, advanced plating equipment lines.
- Vendor Management: Partner with global chemical and equipment suppliers to evaluate new technologies and optimize chemical consumption costs.
- Cross-Functional Collaboration: Work closely with the R&D and New Product Introduction (NPI) teams to transition advanced plating processes into high-volume manufacturing.
3. Team Leadership & People Management
- Talent Development: Manage and mentor a multi-tiered team of plating engineers, laboratory technicians, and production shift supervisors.
- Culture: Foster a data-driven, continuous improvement culture using Lean Six Sigma methodologies.
Requirements:
- Education: Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Chemistry, Materials Science, or a related technical discipline.
- Experience:
- Minimum 10+ years of engineering experience in the semiconductor, IC substrate, or advanced PCB industry.
- Minimum 5+ years in a managerial or senior leadership role directly overseeing wet chemical and plating processes.
- Deep technical mastery of Electroless Copper Plating, Copper Electroplating (ECD), Desmear, and micro-via filling processes.
- Expert knowledge of chemical bath analysis, automated dosing systems, and analytical lab tracking (e.g., Cyclic Voltammetric Stripping - CVS).
Pay: RM12,000.00 - RM23,000.00 per month
Application Question(s):
- Which type of plating experience do you have? Can you list out?
Education:
Experience:
- Plating: 10 years (Preferred)
- Managerial position: 5 years (Preferred)
Work Location: In person