- Yishun North Region (Singapore) Singapore
Kerja Sepenuh Masa Senior-Staff Engineer (Customer Quality Engineering), Gaji tinggi SGD 7,400 di STATS ChipPAC Pte. Ltd. North Region (Singapore) - Maukerja
Senior-Staff Engineer (Customer Quality Engineering)
STATS ChipPAC Pte. Ltd.
Kongsi
Simpan
Lokasi Kerja
Penerangan Kerja
Tanggungjawab
Handle and responds on customer quality issue
Define and implement Quality Assurance strategies for process stability, risk mitigation, and regulatory/customer compliance.
Conduct process audits and internal layered audits, ensuring timely follow-up, verification, and closure of findings.
Establish and enhance in-process control gates to strengthen risk mitigation.
Train QA operators and engineers on customer-specific requirements, SOPs, and quality standards.
Perform process, product, equipment, and recipe buy-off to ensure readiness and compliance before release.
Conduct audits and ensure compliance with requirements.
Review and approve Statistical Bin Limits (SBL), Statistical Yield Limits (SYL), Out-of-Control (OOC), and Out-of-Spec (OOS) events.
Chair weekly Quality Deep Dive meetings with Operations to review performance, risks, and improvement actions.
Drive defect reduction programs, Quality Control Circles (QCC), and Continuous Improvement Projects (CIP).
Lead and validate 8D, FMEA, and RCA activities, ensuring robust CAPA implementation.
Perform in-line quality audits, SPC monitoring, and process verifications to sustain control.
Prepare, maintain, and ensure compliance of process quality documentation (Control Plans, FMEA, PPAP, APQP, and MSA deliverables).
Identify and implement Poka-Yoke solutions and automation in quality checks.
Ensure successful recertification and compliance to ISO 9001, IATF 16949, ISO 27001, ISO 15408 (Common Criteria), and ESD S20.20.
Support customer audits, corporate automotive program requirements, and facilitate internal audits.
Track, monitor, and achieve departmental KPIs, reporting progress to management.
Lead or participate in process improvement initiatives, cross-functional task forces, and CIP reviews.
Develop, maintain, and continuously improve operational specifications.
Review, interpret, and implement customer requirements into internal processes.
Develop and maintain QA databases, digital workflows, and control systems for efficiency and traceability
Job Requirements:
Degree, Post Graduate Diploma or Professional Degree in Engineering (Electrical/Electronic) or equivalent.
At least 3 year(s) of working experience in the related field is required for this position.
Experience in communicating with all level of customers will be advantageous
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
Define and implement Quality Assurance strategies for process stability, risk mitigation, and regulatory/customer compliance.
Conduct process audits and internal layered audits, ensuring timely follow-up, verification, and closure of findings.
Establish and enhance in-process control gates to strengthen risk mitigation.
Train QA operators and engineers on customer-specific requirements, SOPs, and quality standards.
Perform process, product, equipment, and recipe buy-off to ensure readiness and compliance before release.
Conduct audits and ensure compliance with requirements.
Review and approve Statistical Bin Limits (SBL), Statistical Yield Limits (SYL), Out-of-Control (OOC), and Out-of-Spec (OOS) events.
Chair weekly Quality Deep Dive meetings with Operations to review performance, risks, and improvement actions.
Drive defect reduction programs, Quality Control Circles (QCC), and Continuous Improvement Projects (CIP).
Lead and validate 8D, FMEA, and RCA activities, ensuring robust CAPA implementation.
Perform in-line quality audits, SPC monitoring, and process verifications to sustain control.
Prepare, maintain, and ensure compliance of process quality documentation (Control Plans, FMEA, PPAP, APQP, and MSA deliverables).
Identify and implement Poka-Yoke solutions and automation in quality checks.
Ensure successful recertification and compliance to ISO 9001, IATF 16949, ISO 27001, ISO 15408 (Common Criteria), and ESD S20.20.
Support customer audits, corporate automotive program requirements, and facilitate internal audits.
Track, monitor, and achieve departmental KPIs, reporting progress to management.
Lead or participate in process improvement initiatives, cross-functional task forces, and CIP reviews.
Develop, maintain, and continuously improve operational specifications.
Review, interpret, and implement customer requirements into internal processes.
Develop and maintain QA databases, digital workflows, and control systems for efficiency and traceability
Job Requirements:
Degree, Post Graduate Diploma or Professional Degree in Engineering (Electrical/Electronic) or equivalent.
At least 3 year(s) of working experience in the related field is required for this position.
Experience in communicating with all level of customers will be advantageous
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
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