Kerja Sepenuh Masa, Staff Engineer, Packaging Engineering, Structural Simulation di Sandisk WP Kuala Lumpur - Maukerja

ESSENTIAL DUTIES AND RESPONSIBILITIES:

As a Staff Engineer, Packaging Engineering, you will work in the Packaging R&D group on the modeling and simulation, design of experiment and testing across semiconductor packaging, flash memory product and host levels. 

• Responsible for influencing package and product design by addressing the structural integrity and reliability issues in particular and advancing the technology of semiconductor packaging in general. The scope is to address all mechanical aspects of packaging technology and associated material and process interactions. The focus will be on solutions to meet increased demands for small form factor packages with thinner chips, denser interconnects, higher power, and higher reliability.
• Responsible for the modeling and simulation, design of experiment, and testing, whichever comes first for best engineering practice, of mechanical responses of IC package and flash products including solid state drives.
• This position will interface with package & product design, electrical and physical characterization, reliability testing, failure analysis, assembly R&D and other process teams.
• Solid background in applied mechanics, especially computational and/or experimental solid mechanics, is required. In-depth knowledge of IC packaging is highly desired.

Required:

• Ph.D. in Mechanical Engineering plus >3 year, or M.S. in Mechanical Engineering plus >5 years
• Solid knowledge through academic coursework or experience required in mechanical engineering of IC packaging and related areas.
• Strong background in computational solid mechanics and/or experimental solid mechanics with emphasis on failure analysis and design of experiment.
• Broad knowledge of mechanical behaviors of various material types, including composite laminates, polymers, and metals (e.g., solder).
• Working knowledge in designing and conducting mechanical testing and/or using a commercial FEA package.
• Good understanding of general semiconductor packaging processes, materials, technology and trends, such as substrate design and manufacturing, molding, wire-bonding, die attach, flip chip, etc.
• Develop inhouse structural simulation automation platform based on commercial software's (e.g. ANSYS, Abaqus) 
• Candidate will be responsible for the modeling and simulation of mechanical responses of the IC package and flash products using analytical and computational tools. 
• Knowledge of machine learning and data analytics utilizing AI is a plus
• Ability to work in a fast-paced, goal-oriented environment and adapt to changing priorities
• Experience with industry standards and regulations in semiconductor packaging

Skills:

• Strong oral and written communication skills.
• Demonstrated strong work ethic.
• Ability to work in a global team environment and interact with other engineers to define and implement experiments and conduct relevant simulation for feasibility and validation of concepts and provide design solutions to support new package technology development