Kerja Sepenuh Masa, Die Attach Equipment Technician di NXP Semiconductors WP Kuala Lumpur - Maukerja

Die Attach Equipment Technician specialist and vast experience working on Die Attach equipment such as Datacon 8800 FC QUANTUM is a must and preferable also have experience on Hanwha Die Attach equipments.

Maintain and repair Die Attach integrated line which include loader, unloader, die attach, AOI and reflow oven equipment.

Perform equipment setup or conversion for any product changes for Die Attach integrated line which include loader, unloader, die attach, AOI and reflow oven equipment.

To able to work independently to identify, sustain, purchase, find second source for Die Attach integrated critical spare and tooling.

To maintain/sustain equipment performance to meet define goal.

Improve FC Overall OEE, MTBA/MTBF, PM Effectiveness and Unscheduled Downtime.

To maintain the machine performance, address the problem root cause and solve quality issue cause by the machine.

Compensation Details

Support production to meet weekly schedule targets through working either normal or shift hours when or where needed. This especially true weekends and public holidays.

Manage the maintenance activities of machines and fabrication of spare parts.

Good discipline and tardiness with minimum supervise

Requirement

Diploma in Electrical & Electronics or Mechanical and Engineering discipline, or certificate with min 5 years’ of relevant working experience in Die Attach equipment

Experience in semiconductor assembly and applied statistics will be an advantage

Have good technical skills on Front and Back End assembly equipment

Strong interpersonal and communication skills

Good decision making / problem solving skills.

Familiar with production environment & possesses process handling knowledge. (Semiconductor).

Must be discipline and willing to work long hours and shifts.

Must adhere NXP Total Quality Mindset and Safety Awareness.

Must adhere NXP core value Trust and Respect, Collaboration, Ownership, Expertise, Innovation and Growth.

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