- Kuala Lumpur Federal Territory Malaysia
Kerja Package Roadmap Tool Intern – Package Innovation di NXP Semiconductors Federal Territory - Maukerja
Kongsi
Simpan
Lokasi Kerja
Penerangan Kerja
Tanggungjawab
Role Summary
Develop and enhance tools to enable structured definition, visualization, and management of package technology roadmaps across platforms.
Key Responsibilities
Develop and enhance tools to enable structured definition, visualization, and management of package technology roadmaps across platforms.
Key Responsibilities
- Design and implement a Package Roadmap Tool to track technology evolution, capabilities, and platform alignment
- Participate and support Platform Manager lead to integrate inputs from business lines, competitive analysis, and supplier data into a centralized roadmap framework
- Improve data structure, usability, and automation of roadmap tracking (e.g., dashboards, visualizations)
- Participate and support Platform Manager lead for roadmap reviews and ensure alignment with PI strategy, cost targets, and technology readiness
- Collaborate cross-functionally with platform, API, and manufacturing teams
- Participate in ATKL manufacturing projects to build foundational knowledge of package assembly and process flows
- Degree candidate in Computer Science (preferred), Engineering, or related field
- Strong programming and data structuring skills (e.g., Python, data tools, automation frameworks)
- Experience with Excel, Power BI, or similar tools for visualization and tool development
- Ability to translate technical inputs into structured, scalable frameworks
- Self-driven with strong collaboration and communication skills
Peringatan Penting
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