Kerja Sepenuh Masa, Packaging Engineer di ASEM - Advanced Semiconductor Academy Of Malaysia Selangor - Maukerja

Company Description ASEM (Advanced Semiconductor Excellence Malaysia) is a national initiative under the Malaysia IC Design Park, aligned with the National Semiconductor Strategy and led by the Ministry of Economy with strong support from the Selangor State Government and SIDEC. Its mission is to transform Malaysia’s semiconductor industry from “Made in Malaysia” to “Made by Malaysia” by driving original design manufacturing and local participation in product design, prototyping, and production. ASEM provides industry stakeholders with access to advanced EDA tools, testing infrastructure, IP resources, MPW services, talent development programs, and the Selangor Semiconductor Fund. Through partnerships with leading global institutions and over 25 local universities, as well as 150+ industry partners and key foundries, ASEM fosters collaboration, research, and talent mobility. This ecosystem offers semiconductor professionals opportunities for career growth, advanced training, and involvement in cutting-edge projects.
Role Description The Packaging Engineer is a full-time, on-site role based in Cyberjaya. This role is responsible for designing, developing, and optimizing semiconductor packaging solutions, including evaluating materials, thermal and mechanical performance, and reliability. The Packaging Engineer will collaborate with cross-functional teams on product design, process development, and prototyping, while supporting technology transfer from design to manufacturing. Daily activities include conducting technical analyses, preparing documentation and design reports, coordinating with foundries and equipment vendors, and contributing to R&D initiatives within ASEM’s ecosystem. The role also involves managing project timelines, supporting continuous improvement efforts, and mentoring talent in packaging-related activities as needed.
Qualifications

• Strong foundation in Packaging Engineering and Packaging Design for semiconductor devices.
• Experience in Research and Development (R&D), including prototyping, testing, and data-driven optimization of packaging solutions.
• Proficiency in Project Management for technical projects, including planning, coordination, and progress tracking.
• Background in Mechanical Engineering, with understanding of thermal, mechanical stress, and reliability considerations in electronic packaging.
• Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
• Familiarity with semiconductor manufacturing processes, packaging technologies, and industry standards.
• Ability to use relevant design and simulation tools (e.g., CAD, FEA, thermal analysis) is highly beneficial.
• Strong analytical, problem-solving, and communication skills, with the ability to work collaboratively in multidisciplinary teams.
• Experience working with foundries, OSATs, or semiconductor packaging houses is an advantage.