jobs in RF360 SINGAPORE PTE. LTD.

Kerja Sepenuh Masa Engineer, Staff (Ref: TD3088592), Gaji tinggi SGD 9,000 di RF360 SINGAPORE PTE. LTD. Central Region (Singapore) - Maukerja

Engineer, Staff (Ref: TD3088592)

RF360 SINGAPORE PTE. LTD.

SGD9,000 - SGD9,000 Sebulan

Central Region (Singapore)

Kongsi
Simpan

Lokasi Kerja

  • 166 KALLANG WAY Central Region (Singapore) Singapore

Penerangan Kerja

Tanggungjawab

Job Responsibilities:

Technology Development

  • Lead development of new processes, modules, or integration flows from concept to qualification and manufacturing release.
  • Define process requirements, success criteria, design‑of‑experiments (DOE), and characterization plans.
  • Drive root‑cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets.
  • Translate product requirements into process specifications and control strategies.

Technology Transfer & Ramp

  • Co-own the technology transfer roadmap with project leader - from pilot line to high‑volume manufacturing. Adapts to shifting priorities and resources while ensuring deadlines are met.
  • Supervise and provide technical guidance to onsite process transfer activities, including documentation (PFMEA, etc), training, process replication, and equipment matching.
  • Work with each process cluster to establish critical process windows, statistical control limits, and ramp‑readiness criteria.
  • Coordinate and report ramp performance tracking (yield, scrap, cycle time, tool capability) and drive closure of gaps.


Job Requirements:

  • Bachelor’s or Master’s degree in Engineering (Materials, Chemical, Semiconductor, etc.).
  • 5+ years of experience in process integration engineering, technology development, or a high-volume manufacturing fab.
  • Broad exposure to wafer-level packaging technology and processes.
  • Demonstrated success leading cross-disciplinary technology integration projects.
  • Strong skills in DOE, SPC, data analytics, FMEA, and troubleshooting.
  • Excellent communication, technical documentation, and stakeholder management skills.
  • Resourceful with critical thinking in problem solving.
  • Project and priority management skills.
  • Experience in semiconductor, MEMS, packaging, or high‑volume manufacturing.
  • Familiarity with yield engineering, reliability mechanisms, and failure analysis as well as use of statistical tools, DOE, PFCP/ PFMEA, etc.
  • Experience with scale-up from R&D → Pilot → HVM.
  • Knowledge of Lean, Six Sigma, or structured problem-solving (8D, DMAIC).
  • Able to multi-task, set priorities and meet critical deadlines. Maintain open communication.

Peringatan Penting

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