- Tanjong Pagar Central Region (Singapore) Singapore
Kerja Sepenuh Masa Senior Process Integration Engineer (Technology-Development-Manufacturing), Gaji tinggi SGD 7,000 di Tempserv Pte. Ltd. Central Region (Singapore) - Maukerja
Senior Process Integration Engineer (Technology-Development-Manufacturing)
Tempserv Pte. Ltd.
Kongsi
Simpan
Lokasi Kerja
Penerangan Kerja
Tanggungjawab
Key Responsibilities
Development and optimization of RFSOI process technologies for 2DIC and 3DIC.
Collaborate with device teams to co-optimize RF device performance and layout for high-volume manufacturing.
Drive yield improvement, reliability testing, and failure analysis for RFSOI products.
Interface with fab teams to scale new technologies from R&D to production.
Evaluate emerging materials, process modules, and device structures to enhance RF performance.
Qualifications
Masters or Ph.D. in Electrical Engineering, Materials Science, Semiconductor Physics, or related field.
3+ years of experience in RF semiconductor technology development, with a strong focus on SOI platforms preferred.
Proven track record in developing and transferring RF technologies to high-volume manufacturing preferred.
Strong project management and communication skills.
Interested applicants, please click
“Apply Now”
or email your detailed resume (MS Word or PDF) to:
••••*************
Tempserv Pte Ltd
EA License No: 06C3745
Consultant: Chuah Siew Ping/EA Personnel No: R24123260
TEMPSERV PTE. LTD.
We are a rapidly expanding recruitment firm that delivers reliable manpower solutions to meet our clients' needs. Established in 2005, we've been catering to a rich diversity of corporations in various business fields: banking, manufacturing, IT and healthcare etc.
We pride over our diverse recruitment categories under the three main themes: Temporary & Contract, Permanent Placement and Executive Recruitment.
Development and optimization of RFSOI process technologies for 2DIC and 3DIC.
Collaborate with device teams to co-optimize RF device performance and layout for high-volume manufacturing.
Drive yield improvement, reliability testing, and failure analysis for RFSOI products.
Interface with fab teams to scale new technologies from R&D to production.
Evaluate emerging materials, process modules, and device structures to enhance RF performance.
Qualifications
Masters or Ph.D. in Electrical Engineering, Materials Science, Semiconductor Physics, or related field.
3+ years of experience in RF semiconductor technology development, with a strong focus on SOI platforms preferred.
Proven track record in developing and transferring RF technologies to high-volume manufacturing preferred.
Strong project management and communication skills.
Interested applicants, please click
“Apply Now”
or email your detailed resume (MS Word or PDF) to:
••••*************
Tempserv Pte Ltd
EA License No: 06C3745
Consultant: Chuah Siew Ping/EA Personnel No: R24123260
TEMPSERV PTE. LTD.
We are a rapidly expanding recruitment firm that delivers reliable manpower solutions to meet our clients' needs. Established in 2005, we've been catering to a rich diversity of corporations in various business fields: banking, manufacturing, IT and healthcare etc.
We pride over our diverse recruitment categories under the three main themes: Temporary & Contract, Permanent Placement and Executive Recruitment.
Peringatan Penting
Jangan pernah kongsikan maklumat bank atau kad kredit anda semasa memohon pekerjaan. Elakkan membuat sebarang pembayaran atau mengisi survey yang tidak berkaitan. Jika ada yang mencurigakan, sila laporkan iklan pekerjaan ini segera.
Lebih Lanjut