jobs in Versatile Creation Sdn Bhd

Kerja Sepenuh Masa R-D Engineer - Specialist – Cu Pillar Plating, Gaji tinggi MYR 11,000 di Versatile Creation Kedah - Maukerja

R-D Engineer - Specialist – Cu Pillar Plating

Kongsi
Simpan

Lokasi Kerja

  • Kulim Kedah Malaysia

Penerangan Kerja

Tanggungjawab

Job Responsibilities

  • Develop and optimize Cu pillar electroplating processes to achieve required thickness, height, profile, uniformity and yield.
  • Control plating parameters such as current density, temperature, agitation, chemistry and plating time.
  • Develop and maintain plating bath control and chemical replenishment methods.
  • Conduct DOE, process characterization and statistical analysis to improve process capability.
  • Troubleshoot plating defects such as non-uniform growth, nodules, pits, voids, burning and poor adhesion.
  • Work closely with lithography, seed deposition/etch and downstream processes to ensure smooth process integration.
  • Support equipment and chemical qualification, process documentation and manufacturing ramp-up.
  • Conduct root cause analysis and drive corrective actions for process issues.

Requirements

  • Bachelor's or Master's Degree in Chemical Engineering, Chemistry, Materials Science, Electrochemistry, Electronics or related field.
  • 5+ years of relevant experience in semiconductor, IC substrate, PCB or advanced packaging electroplating.
  • Experience in Cu pillar, RDL, fine-feature plating or wafer bumping is highly preferred.
  • Strong knowledge of electrochemistry, plating chemistry and process control.
  • Hands-on experience with plating equipment, chemical analysis and profile/metrology tools.
  • Knowledge of lithography and seed-layer processes is an advantage.
  • Strong experience in DOE, SPC, MSA, FMEA and root cause analysis.
  • Good analytical, problem-solving and communication skills.

Pay: RM4,000.00 - RM11,000.00 per month

Application Question(s):

  • How many years of electroplating experience do you have?
  • Do you have hands-on Cu pillar, RDL, wafer bumping, or fine-feature plating experience?
  • Do you have experience with plating bath chemistry and chemical analysis?
  • Do you have experience with DOE, SPC, MSA, FMEA and RCA?
  • Current Basic salary (monthly), allowance, notice period?

Work Location: In person

Peringatan Penting

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