Kerja Sepenuh Masa Failure analysis Development Engineer (Shift role), Gaji tinggi SGD 6,000 di ADVANCED MICRO DEVICES (SINGAPORE) PTE LTD Islandwide (Singapore) - Maukerja

THE ROLE

The Failure Analysis Engineer will be responsible for investigating yield and reliability issues on advanced microprocessors, graphics processors, and heterogeneous integration products built on leading-edge 3nm FinFET and below technologies. The role involves end-to-end failure analysis, advanced sample preparation, defect localization, and material characterization using state-of-the-art analytical techniques. This individual will work closely with product, process, and manufacturing teams to identify root causes of failures and drive continuous improvements in product quality, yield, and reliability.

THE PERSON

The ideal candidate is a hands-on semiconductor professional with strong expertise in failure analysis, device physics, and materials characterization. They are comfortable working with advanced analytical tools such as FIB, TEM, AFM, electron microscopy, and nano-probing techniques to solve complex silicon and package-level issues. The successful candidate is detail-oriented, technically curious, and capable of troubleshooting both process and equipment-related challenges. Experience mentoring junior engineers or technicians, combined with the ability to collaborate effectively across engineering and manufacturing teams, will be highly valued.

KEY RESPONSIBILITIES: 

• The position focuses on the failure analysis of advanced microprocessors and graphics processors based on 3nm FINFET and below technologies.
• Perform comprehensive failure analysis including transistor nano-probing, electrical characterization using AFM, Electron Microscopy and Material Analysis.
• Perform advanced sample preparation for SoIC and other heterogeneous integration products, including planar, cross-sectional and site-specific preparation
• Prepare high-quality site-specific TEM lamellae using focused ion beam techniques for structural, material, interface, and defect characterization
• Conduct plasma FIB sample preparation and yield failure analysis on advanced products, including large-volume material removal, defect localization, cross-sectioning, and preparation for downstream analytical techniques
• Follow laboratory safety, EHS, operating procedures, and quality requirements, particularly when operating high-energy beam systems and handling chemicals during night shifts.
• Support continuous improvement and automation initiatives to increase sample-preparation success rate, throughput, tool utilization, and turnaround time.
• Support continuous improvement and automation initiatives to increase sample-preparation success rate, throughput, tool utilization, and turnaround time.

PREFERRED EXPERIENCE: 

• Able to work in 12hrs alternate 4days / 3days night shift. Attractive allowance provided.
• Preferable to have mentored / managed junior engineers, associate engineers & technicians.
• Candidate should possess a fundamental understanding of device physics
• A strong background in semiconductor wafer processing and materials characterization is preferred.
• An ability to perform basic tool troubleshooting and interact with vendor to resolve tool issues.
• Candidates with experience in fabless semiconductor and wafer fabs are highly preferred.

ACADEMIC CREDENTIALS: 

• B.Eng in Electrical Engineering, Microelectronics, Materials Engineering and related fields.