- Experience in Die Attach Process.
30+ hari
15 Jawatan Kosong Assembly - Oktober 2026 - Gaji Tinggi
Paparan 15 hasil carian kerja kosong untuk
"assembly"
- Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
30+ hari
- Experienced in Wirebond process and able to perform troubleshooting, set-up, conversion and recipe creation.
30+ hari
- Experienced in Wirebond process and able to perform troubleshooting, set-up, conversion and recipe creation.
30+ hari
- Experience in Die Attach Process.
30+ hari
- Practical experiences with all the equipment’s in die attach process.
30+ hari
- Fluent in English, and Bahasa Malaysia.
30+ hari
- Fluent in English, and Bahasa Malaysia.
30+ hari
- Fluent in English, and Bahasa Malaysia.
30+ hari
- Fluent in English, and Bahasa Malaysia.
30+ hari
- Fluent in English, and Bahasa Malaysia.
30+ hari
- Fluent in English, and Bahasa Malaysia.
30+ hari
- Fluent in English, and Bahasa Malaysia.
30+ hari
- Independent with good communication skills and ability to work effectively in a cross functional environment with people at all levels.
30+ hari
- Good knowledge of FMEA, DOE, SPEC and risk analysis.
30+ hari