100+ Jawatan Kosong Diet - October 2026 - Gaji Tinggi - Halaman 4

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Urus Pemberitahuan

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Equipment Technician (Die Prep-Surface Mount Technology)TF-AMD PenangSepenuh MasaBayan Lepas

Process Engineer (Die Attach - Wire Bond - Active Alignment - Overall Line)LumilensSepenuh MasaSingapore

Die Design EngineerMolexSepenuh MasaSingapore

Principal Engineer Unit Process Development Die AttachInfineon TechnologiesSepenuh MasaMalacca City

R-D Process Engineer (Die-to-Wafer)STATS CHIPPAC MANAGEMENT PTE. LTD.Sepenuh MasaYishun

R-D Process Engineer (Die-to-Wafer)STATS CHIPPAC MANAGEMENT PTE. LTD.Sepenuh MasaSingapore

MAINTENANCE TECHNICIAN (DIE BOND-WIRE BOND-ENCAPSULATION-TEST PROCESS)DOMINANT OPTO TECHNOLOGIES SDN.BHDSepenuh MasaMalaysia

Process Development Senior Engineer (Die Attach - Wire Bond)OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., PenangSepenuh MasaBayan Lepas

Staff Engineer Maintenance Die AttachInfineon TechnologiesSepenuh MasaMalacca City

Staff Engineer Maintenance Die AttachInfineon TechnologiesSepenuh MasaMalacca City

Senior Engineer Development Die AttachInfineon TechnologiesSepenuh MasaMalacca City

SOSM QFN Die Bond and Wire Bond Equipment EngineerOnsemiSepenuh MasaSeremban

Die Prep Process Engineer (MES Project)Texas InstrumentsSepenuh MasaKL City

Die Prep Equipment Engineer (MES Project)Texas InstrumentsSepenuh MasaKL City

Die Prep Process Engineer (MES Project)Texas InstrumentsSepenuh MasaKL City

Die Prep Equipment Engineer (MES Project)Texas InstrumentsSepenuh MasaKL City

Senior Staff Engineer Equipment Engineering Die Bond- SMTInfineon TechnologiesSepenuh MasaMalacca City

SOSM QFN Die Bond and Wire Bond Equipment EngineerOnsemiSepenuh MasaSeremban

FOL Process Engineering Lead - Manager – Pre-Assembly, Die Attach - Wire BondSTMicroelectronicsSepenuh MasaMalaysia

Wirebond - Die Attach Process Engineer (MES Project)Texas InstrumentsSepenuh MasaKL City

Wirebond - Die Attach Process Engineer (MES Project)Texas InstrumentsSepenuh MasaKL City

Senior Engineer Development Die AttachInfineon TechnologiesSepenuh MasaMalacca City

Assembly Die Bond Process EngineerNXP SemiconductorsSepenuh MasaKL City

Process - Application Engineer (Die-Bonding - Thermo Compression Bonding - Visual inspection)EW ELITE SEARCH PTE. LTD.Sepenuh MasaSingapore

Wire Bond - Die Attach Equipment Engineer (MES Project)Texas InstrumentsSepenuh MasaKL City

Equipment Engineer(Assemble-Injection Molding-Die-casting-Stamping)SHB MALAYSIA AUTOMOTIVE APPLIANCE SDN. BHD.Sepenuh MasaSenai

Wire Bond - Die Attach Equipment Engineer (MES Project)Texas InstrumentsSepenuh MasaKL City

Engineer-Staff Engineer – Multi-Dies Physical Verification EngineerMediaTekSepenuh MasaSingapore

[0580] Quality Control - Test Executive – Semiconductor Equipment - Die Bonder | Woodlands- 5 days- $3.5kTHE SUPREME HR ADVISORY PTE. LTD.Sepenuh MasaSingapore

Quality Control Engineer (Semiconductor Equipment - Die Bonder) | Woodlands- 5 days- $3.5k | 0580THE SUPREME HR ADVISORY PTE. LTD.Sepenuh MasaSingapore

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