Jawatan Kosong Electronics Engineering di Bayan Lepas - August 2026
Paparan 93 hasil carian kerja kosong untuk
"electronics engineering"
di Bayan Lepas
Undisclosed
- Diploma in Electrical/Electronics/Mechanical Engineering.
- Basic knowledge in Molding process (Hydraulic and servo system,)
- Able to read schematic diagram. ...
Jadilah pemohon terawal!
Posted
11 days ago
Boleh Sembang
Undisclosed
- Diploma in Electrical/Electronics/Mechanical Engineering.
- Basic knowledge in Molding process (Hydraulic and servo system,)
- Able to read schematic diagram. ...
Jadilah pemohon terawal!
Posted
11 days ago
Undisclosed
- Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
- Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
- Job Overview: ...
Jadilah pemohon terawal!
Posted
12 days ago
Undisclosed
- Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
- Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
- Job Overview: ...
Jadilah pemohon terawal!
Posted
12 days ago
Undisclosed
- Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
- Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
- Job Overview: ...
Jadilah pemohon terawal!
Posted
12 days ago
Undisclosed
- Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
- Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
- Job Overview: ...
Jadilah pemohon terawal!
Posted
12 days ago
Boleh Sembang
Undisclosed
- Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
- Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
- Job Overview: ...
Jadilah pemohon terawal!
Posted
12 days ago
Undisclosed
- Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
- Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
- Job Overview: ...
Jadilah pemohon terawal!
Posted
12 days ago
Undisclosed
- Additional Desirable Qualifications: Fresh Grad/Min 1 years relevant working experience in semiconductor / Electronics manufacturing environment.
- Job Overview:
- Responsible for supporting encap production line include Pre-Encap Plasma – Encap cure process. Responsible for any product yield and machine downtime related issue with regards to equipment, maintenance, product and process.
Jadilah pemohon terawal!
Posted
11 days ago
Boleh Sembang
Undisclosed
- Additional Desirable Qualifications: Fresh Grad/Min 1 years relevant working experience in semiconductor / Electronics manufacturing environment.
- Job Overview:
- Responsible for supporting encap production line include Pre-Encap Plasma – Encap cure process. Responsible for any product yield and machine downtime related issue with regards to equipment, maintenance, product and process.
Jadilah pemohon terawal!
Posted
11 days ago
Boleh Sembang
Undisclosed
- Good knowledge of FMEA, DOE, SPEC and risk analysis.
- Independent with good communication skills and ability to work effectively in a cross functional environment with people at all levels.
- Degree in Mechanical/ Electronics / Electrical /Mechanical Engineering. ...
Jadilah pemohon terawal!
Posted
12 days ago
Undisclosed
- Good knowledge of FMEA, DOE, SPEC and risk analysis.
- Independent with good communication skills and ability to work effectively in a cross functional environment with people at all levels.
- Degree in Mechanical/ Electronics / Electrical /Mechanical Engineering. ...
Jadilah pemohon terawal!
Posted
12 days ago
Undisclosed
- Experience in Die Attach Process.
- Have equipment or process programming knowledge background.
- Basic communication skills and good learning and feedback ability. ...
Jadilah pemohon terawal!
Posted
12 days ago
Undisclosed
- Experience in Die Attach Process.
- Have equipment or process programming knowledge background.
- Basic communication skills and good learning and feedback ability. ...
Jadilah pemohon terawal!
Posted
12 days ago
Undisclosed
- Experience in Die Attach Process.
- Have equipment or process programming knowledge background.
- Basic communication skills and good learning and feedback ability. ...
Jadilah pemohon terawal!
Posted
12 days ago
Undisclosed
- Experience in Die Attach Process.
- Have equipment or process programming knowledge background.
- Basic communication skills and good learning and feedback ability. ...
Jadilah pemohon terawal!
Posted
12 days ago
Undisclosed
- Experience in Die Attach Process.
- Have equipment or process programming knowledge background.
- Basic communication skills and good learning and feedback ability. ...
Jadilah pemohon terawal!
Posted
12 days ago
Boleh Sembang
Undisclosed
- Experience in Die Attach Process.
- Have equipment or process programming knowledge background.
- Basic communication skills and good learning and feedback ability. ...
Jadilah pemohon terawal!
Posted
12 days ago
Up to MYR6,500 Sebulan
- Established customer network and proven sales track record.
- Strong communication, negotiation, and presentation skills.
- Target-driven with strong business development mindset. ...
Jadilah pemohon terawal!
Posted
21 days ago
Undisclosed
- Practical experiences with all the equipment’s in die attach process.
- Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
- Job Overview: ...
Jadilah pemohon terawal!
Posted
7 days ago
Undisclosed
- Minimum qualification is a Diploma in Electronics/Microelectronics.
- The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company.
- Well versed in using FA & Rel related equipment such as Microscope, Parametric Analyzer, X-ray, CSAM, SEM-EDX, Decapper, TDR, Micro Prober station, FTIR, HAST, Bake oven, Reflow machine, TC chamber, Burn in oven and etc. ...
Jadilah pemohon terawal!
Posted
11 days ago
Boleh Sembang
Undisclosed
- Minimum qualification is a Diploma in Electronics/Microelectronics.
- The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company.
- Well versed in using FA & Rel related equipment such as Microscope, Parametric Analyzer, X-ray, CSAM, SEM-EDX, Decapper, TDR, Micro Prober station, FTIR, HAST, Bake oven, Reflow machine, TC chamber, Burn in oven and etc. ...
Jadilah pemohon terawal!
Posted
11 days ago
Undisclosed
- Degree in Electronics / Electrical /Chemical/Mechanical Engineering
- Additional Desirable Qualifications:
- Practical experiences with all the equipment’s in die attach process. ...
Jadilah pemohon terawal!
Posted
12 days ago
Undisclosed
- Degree in Electronics / Electrical /Chemical/Mechanical Engineering
- Additional Desirable Qualifications:
- Practical experiences with all the equipment’s in die attach process. ...
Jadilah pemohon terawal!
Posted
12 days ago
Undisclosed
- Degree in Electronics / Electrical /Chemical/Mechanical Engineering
- Additional Desirable Qualifications:
- Practical experiences with all the equipment’s in die attach process. ...
Jadilah pemohon terawal!
Posted
12 days ago
Undisclosed
- Degree in Electronics / Electrical /Chemical/Mechanical Engineering
- Additional Desirable Qualifications:
- Practical experiences with all the equipment’s in die attach process. ...
Jadilah pemohon terawal!
Posted
12 days ago
Undisclosed
- Practical experiences with all the equipment’s in die attach process.
- Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
- Job Overview: ...
Jadilah pemohon terawal!
Posted
14 days ago
Boleh Sembang
Undisclosed
- Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
- Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
- Job Overview: ...
Posted
12 days ago
Boleh Sembang
Undisclosed
- Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
- Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
- Job Overview: ...
Posted
12 days ago
Boleh Sembang
Undisclosed
- Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
- Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
- Job Overview: ...
Posted
12 days ago