Jawatan Kosong Packing di Bayan Lepas - September 2026

Paparan 9 hasil carian kerja kosong untuk "packing" di Bayan Lepas
Jangan lepaskan peluang untuk kerja Packing terkini! di Bayan Lepas
MYR3,000 - MYR3,600 Sebulan
  • Familiarity with material analysis techniquessuch asFTIR, XPS, and ToF-SIMS is an advantage.
  • Bachelor’s degree or higher in Material Science, Physics, Mechanical, or Chemical Engineering, or equivalent.
  • Knowledge of analytical tools such as Parametric Analyzer, Keithley Meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, and IR Imaging tools. ...
Posted
2 months ago
Undisclosed
  • Job Overview:
  • To carry out daily maintenance and repair for EOL Pkg Saw equipment.

Jadilah pemohon terawal!

Posted
a month ago
Undisclosed
  • Design new leadframe packages and handle project management.

Jadilah pemohon terawal!

Posted
a month ago
Undisclosed
  • Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
  • Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
  • Job Overview: ...

Jadilah pemohon terawal!

Posted
a month ago
Undisclosed
  • Additional Desirable Qualifications: Fresh Grad/Min 1 years relevant working experience in semiconductor / Electronics manufacturing environment.
  • Job Overview:
  • Responsible for supporting encap production line include Pre-Encap Plasma – Encap cure process. Responsible for any product yield and machine downtime related issue with regards to equipment, maintenance, product and process.

Jadilah pemohon terawal!

Posted
a month ago
Undisclosed
  • Degree in Electronics / Electrical /Chemical/Mechanical Engineering
  • Additional Desirable Qualifications:
  • Practical experiences with all the equipment’s in die attach process. ...

Jadilah pemohon terawal!

Posted
a month ago
Undisclosed
  • Degree in Electronics / Electrical /Chemical/Mechanical Engineering
  • Additional Desirable Qualifications:
  • Practical experiences with all the equipment’s in die attach process. ...

Jadilah pemohon terawal!

Posted
a month ago
MYR3,000 - MYR3,600 Sebulan
  • Familiarity with material analysis techniquessuch asFTIR, XPS, and ToF-SIMS is an advantage.
  • Bachelor’s degree or higher in Material Science, Physics, Mechanical, or Chemical Engineering, or equivalent.
  • Knowledge of analytical tools such as Parametric Analyzer, Keithley Meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, and IR Imaging tools. ...
Posted
2 months ago
MYR3,000 - MYR3,600 Sebulan
  • Familiarity with material analysis techniquessuch asFTIR, XPS, and ToF-SIMS is an advantage.
  • Bachelor’s degree or higher in Material Science, Physics, Mechanical, or Chemical Engineering, or equivalent.
  • Knowledge of analytical tools such as Parametric Analyzer, Keithley Meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, and IR Imaging tools. ...
Posted
2 months ago