Minimum qualification is a Diploma in Electronics/Microelectronics.
The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company.
Well versed in using FA & Rel related equipment such as Microscope, Parametric Analyzer, X-ray, CSAM, SEM-EDX, Decapper, TDR, Micro Prober station, FTIR, HAST, Bake oven, Reflow machine, TC chamber, Burn in oven and etc.
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responsible for developing, optimizing, and maintaining Automated Optical Inspection (AOI) systems used in PQFN semiconductor assembly processes. The role focuses on ensuring high inspection accuracy, minimizing false calls, improving defect detection capability, and supporting continuous yield and quality improvement. The engineer works closely with Process Engineering, Manufacturing, Equipment Engineering, and Quality teams to ensure AOI systems effectively monitor critical assembly processes while supporting production efficiency.
responsible for developing, optimizing, and maintaining Automated Optical Inspection (AOI) systems used in PQFN semiconductor assembly processes. The role focuses on ensuring high inspection accuracy, minimizing false calls, improving defect detection capability, and supporting continuous yield and quality improvement. The engineer works closely with Process Engineering, Manufacturing, Equipment Engineering, and Quality teams to ensure AOI systems effectively monitor critical assembly processes while supporting production efficiency.