- Operate CNC laser cutting machines to cut sheet metal according to engineering drawings and specifications.
30+ days
53 Laser Engineer Jobs - November 2026 - Urgent Hiring
Showing 53 jobs results for
"laser engineer"
- Operate laser cutting machines according to production requirements.
6 days
- Operate laser cutting machines according to production requirements.
6 days
- Operate laser cutting machines according to production requirements.
6 days
- Perform medical-grade facials and post-procedure care
30+ days
Laser Technician
- To perform the Mechanical and Electrical Assembly, Laser Optics Alignment, Calibration and Final Testing on Capital Equipment in according to Technical Instructions.
8 days
STAFF ENGINEER (LASER-PHOTONICS-OPTICS)
18 days
Assistant Laser Process Engineer
- Perform daily laser processing operations according to assigned schedules and processing targets.
7 days
DFB Laser Product Engineer
8 days
Laser Systems and Process Engineer
- Professional development
8 days
Assistant Engineer (Laser)
- Lead in the assembly of the laser sources, and setting up test stations to evaluate performances
17 days
7 days
Senior Engineer, Laser Development
- Design and develop semiconductor laser-based devices
18 days
DFB Laser Product Engineer
20 days
STAFF ENGINEER (LASER-PHOTONICS-OPTICS)
- Develop, optimize, and sustain manufacturing processes for laser modules, optical assemblies, and subsystems to improve yield, quality, throughput, and process capability
19 days
Senior Application Engineer (Physical layer testing)
- Support customers on high-speed digital and optical test solutions
8 days
Manufacturing Engineer, Laser - Automatic Inspection Process
- Operate, monitor, and optimize laser and automated inspection equipment to support production requirements.
21 days
Die-Layer Attach Process Development Staff Engineer
- More than 2 years in semiconductor Die Attach/Layer Attach process engineering field.
7 days
- Lead, develop and optimize dicing/ grinding process to ensure robustness of processes with Line of Defense (LOD), Statistical Process Control (SPC) etc control in place.
5 days
Senior Staff Process Engineer (LLO, Wafer Bonding - Grinding, Laser Dicing)
- Min. 10 years experience in manufacturing environment
7 days
Senior - Associate Process Engineer - Wafer Backgrind, Laser Mark, Wafer Saw
8 days
- Lean & Simple. Our products are simple to use, we focus on what matters, we solve issues one by one and we spend smart.
27 days
- Develop, set up, and industrialize PLP Ball Attach and Package Saw processes .
7 days
Photonics Engineer
- Develop and design photonic devices, packaging and systems, e.g. including lasers, modulators, amplifiers, harmonic generators, splitters, couplers and detectors.
8 days
- Develop, set up, and industrialize PLP Ball Attach and Package Saw processes.
12 days
Senior - Associate Process Engineer - Wafer Backgrind, Laser Mark, Wafer Saw
18 days
Die-Layer Attach Process Development Staff Engineer
- More than 2 years in semiconductor Die Attach/Layer Attach process engineering field.
20 days
Senior - Associate Process Engineer - Wafer Backgrind, Laser Mark, Wafer Saw
- Perform production line sustaining to ensure all the processes are running without any quality issue
19 days
Senior Staff Process Engineer (LLO, Wafer Bonding - Grinding, Laser Dicing)
- Min. 10 years experience in manufacturing environment
25 days
Photonics Engineer
- Develop and design photonic devices, packaging and systems, e.g. including lasers, modulators, amplifiers, harmonic generators, splitters, couplers and detectors.
25 days