The candidate will perform the iming closure, power/signal integrity signoff and EM/IR signoff
The candidate will have the opportunity to work on many varieties of challenging designs, i.e. low power and high speed designs at the latest technology nodes.
The responsibility of the candidate includes participating in or leading next generation physical design, methodology and flow development.
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Planning, monitoring, and executing application development tasks, including new product development, incremental modifications, and timely closure of assigned work.
Providing technical support for testing, installation, commissioning, debugging, and diagnostics activities.
Translating conceptual designs into detailed engineering documentation through modelling, prototyping, simulation, and calculations, while applying design thinking and best practices.
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