Own and manage all Die Bond process technologies, including epoxy die attach, Eutectic die bond process, and advanced die attach processes as applicable.
Have clear understanding about semiconductor manufacturing assembly and test basic requirement to production line such as ESD/5S/C.C. S and follow these requirements strictly and find out problems to report to production technicians in time.
Perform thermo-mechanical simulations and analyses of semiconductor packages, power modules, and electronic assemblies using finite element analysis (FEA) tools.
We will review your application against our job requirements. We do not employ machine learning technologies during this phase as we believe every human deserves attention from another human. We do not think machines can evaluate your application quite like our seasoned recruiting professionals—every person is unique. We promise to give your candidacy a fair and detailed assessment.