- Lot disposition, follow up on evaluation lots, analysis on scrap wafers and coordinate simple engineering experiments
30+ days
C++ Jobs in Seremban - November 2026 - Urgent Hiring - Page 5
Showing 233 jobs results for
"c++"
in Seremban
- Manage and coordinate multiple NPI-related projects to ensure timely, cost-effective, and quality-compliant execution from concept through volume production.
30+ days
- Responsibilities to provide support for manufacturing & maintenance and general work on shift basis.
30+ days
- Perform routine maintenance, troubleshooting, and repair of manufacturing equipment to ensure optimal performance.
30+ days
- Create initial Business Case together with Product Management
30+ days
- Responsibilities to provide support for manufacturing & maintenance and general work on shift basis.
30+ days
- Perform routine maintenance, troubleshooting, and repair of manufacturing equipment to ensure optimal performance.
30+ days
- Perform thermo-mechanical simulations and analyses of semiconductor packages, power modules, and electronic assemblies using finite element analysis (FEA) tools.
30+ days
- Operate and monitor die bond/clip bonder machines to ensure stable production output.
30+ days
ACCOUNTANT, ASSOC
- Processing supplier invoices, maintaining payment schedules, monitoring outstanding items, resolving invoice-related issues, responding to supplier inquiries in timely manner
30+ days
- Have clear understanding about semiconductor manufacturing assembly and test basic requirement to production line such as ESD/5S/C.C. S and follow these requirements strictly and find out problems to report to production technicians in time.
30+ days
- Coordinate and track Engineering Build Requests (EBRs) from initiation to completion.
29 days
- Lead and oversee daily manufacturing operations to achieve production, quality, safety, cost, and delivery targets.
29 days
- We are seeking an experienced and highly technical Senior Equipment Engineer to lead our front end assembly equipment team. You will be responsible for leading shift technicians, ensuring maximum equipment uptime, and performing advanced troubleshooting across our die bond, clip bond, reflow, and inspection lines. The ideal candidate must have strong hands-on engineering experience with ASM/CANON equipment and front end assembly processes.
29 days
- Carry out routine RCM task to ensure equipment in tip top condition.
28 days
- Own and manage all Die Bond process technologies, including epoxy die attach, Eutectic die bond process, and advanced die attach processes as applicable.
28 days
28 days
Business Corporate Banking - SME Graduate Trainee (Seremban)
- Fresh graduates with a minimum CGPA 3.2 or 2nd Class Upper and its equivalent
27 days
Content Creation Officer (TikTok Shop)
- Plan and create engaging TikTok videos to promote products and drive sales.
12 days
Technician 4, lab
- Set up Reliability stress tests (e.g, HTRB, HTGB, TC, PC, THB, etc.) according to schematics and test plans.
11 days
- Lead and oversee daily manufacturing operations to achieve production, quality, safety, cost, and delivery targets.
11 days
Shop Assistant (Seremban 2)
- Receiving, unpacking and arranging newly delivered stocks
11 days
Management Trainee D'Laksa Aeon Seremban 2
- Learn about the company’s background, business operations and strategic planning.
11 days
- Have clear understanding about semiconductor manufacturing assembly and test basic requirement to production line such as ESD/5S/C.C. S and follow these requirements strictly and find out problems to report to production technicians in time.
9 days
- Operate and monitor die bond/clip bonder machines to ensure stable production output.
9 days
- Design test setups and fixturing required for the devices.
9 days
- Perform thermo-mechanical simulations and analyses of semiconductor packages, power modules, and electronic assemblies using finite element analysis (FEA) tools.
8 days
INTERNSHIP – LOGISTICS
- Diploma/Degree in Logistics, Supply Chain Management, or related field
8 days