Die Prep Process Engineer (MES Project)
- MES Implementation (Project Phase): Drive Die Prep process design within the MES. Define flows, routing, and material handling.
27 days
100+ Diet Jobs - October 2026 - Urgent Hiring - Page 4
Showing 161 jobs results for
"diet"
Die Prep Equipment Engineer (MES Project)
- MES Implementation (Project Phase): Represent Die Prep equipment engineering in the MES rollout. Define workflows, setup/recipe controls, and equipment states.
27 days
Die Prep Process Engineer (MES Project)
- MES Implementation (Project Phase): Drive Die Prep process design within the MES. Define flows, routing, and material handling.
27 days
Die Prep Equipment Engineer (MES Project)
- MES Implementation (Project Phase): Represent Die Prep equipment engineering in the MES rollout. Define workflows, setup/recipe controls, and equipment states.
27 days
Senior Staff Engineer Equipment Engineering Die Bond- SMT
- Drive and build planned maintenance definition with high availability, good reliability and appropriate quality performance.
22 days
- Provide engineering support for Die Bond and Wire Bond equipment to ensure high equipment uptime and manufacturing efficiency.
22 days
Senior Engineer Development Die Attach
- Perform process development activities, including process parameter scouting, optimization, verification, and process freeze, to meet project targets for timeline, quality, cost competitiveness, and manufacturability.
30+ days
Assembly Die Bond Process Engineer
- Develop, qualify, and optimize die bonding processes for semiconductor packages.
30+ days
Wirebond - Die Attach Process Engineer (MES Project)
- MES Implementation (Project Phase): Drive manufacturing process design within the MES. Define process flows, routing, material handling, and traceability.
27 days
Wirebond - Die Attach Process Engineer (MES Project)
- MES Implementation (Project Phase): Drive manufacturing process design within the MES. Define process flows, routing, material handling, and traceability.
27 days
- Lead the FOL team in driving process improvement initiatives and operational excellence.
9 days
Process - Application Engineer (Die-Bonding - Thermo Compression Bonding - Visual inspection)
21 days
Wire Bond - Die Attach Equipment Engineer (MES Project)
- MES Implementation (Project Phase): Represent equipment engineering in the MES rollout. Define equipment-specific workflows, setup/recipe controls, qualification requirements, and equipment states.
27 days
Equipment Engineer(Assemble-Injection Molding-Die-casting-Stamping)
- 13th -month + yearly performance bonus.
27 days
Wire Bond - Die Attach Equipment Engineer (MES Project)
- MES Implementation (Project Phase): Represent equipment engineering in the MES rollout. Define equipment-specific workflows, setup/recipe controls, qualification requirements, and equipment states.
27 days
- Responsible for Multi-Dies Physical Verification Sign-off in area of (3D_Stack, 3D_PERC, 3D_ANT) for tape-out.
30+ days
Quality Control Engineer (Semiconductor Equipment - Die Bonder) | Woodlands- 5 days- $3.5k | 0580
- Working Location: Woodlands North Coast
11 days
[0580] Quality Control - Test Executive – Semiconductor Equipment - Die Bonder | Woodlands- 5 days- $3.5k
- Working Location: Woodlands North Coast
3 days
Senior Staff Engineer Equipment Engineering Die Bond- SMT
- Drive and build planned maintenance definition with high availability, good reliability and appropriate quality performance.
30+ days
- Die Attach (DB / Die Bond)
26 days
[0580] Process Engineer – Semiconductor Die Bonding -- Application -- Advanced Packaging | Up to $6k - 5 days - Woodlands
- Working Location: Woodlands North Coast
2 days
- Define, develop, prove out, and deploy manufacturing processes for new products across the transceiver assembly flow (e.g., die attach, wire bond, active alignment, and general assembly), implementing continuous improvement projects to achieve yield, throughput, efficiency, scrap, and quality targets.
30+ days
Mechanical Design Engineer |TCB | Flip-chip | Die-bonding | Up to $9k - JL99
- Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment.
18 days
30+ days
[0580] Senior - Mechanical Design Engineer - TCB - Flip-chip - Die-bonding | North- 5 days- $9k
- Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment.
18 days
- Support all phases of product development required to bring connector concepts into production in accordance with the Molex New Product Development (NPD) process.
30+ days
Mechanical Design Engineer |TCB | Flip-chip | Die-bonding | Up to $9k - JL99
- Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment.
25 days
Quality Control Test Executive – Semiconductor Equipment - Die Bonder | Woodlands- 5 days- $3.5k | 0580
- Working Location: Woodlands North Coast
23 days
[0580] Application - Process Engineer – Semiconductor Die Bonding - Advanced Packaging | Up to $6k - 5 days - Woodlands
- Working Location: Woodlands North Coast
23 days
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