Develop, characterize, qualify, and optimize die attach processes for PIC/silicon photonics dies, laser dies, and EIC-PIC hybrid assemblies, including active/passive alignment epoxy attach, AuSn/eutectic solder attach, and flip-chip bonding.
Lead end-to-end product transfer and manufacturing ramp-up activities, including transfer planning, readiness reviews, qualification and risk mitigation.
Responsible for performing a variety of technical support duties in one or more manufacturing areas, which may involve working with and assisting engineers.
Lead and support a manufacturing team of Photo/lithography Associate engineers(AE) to manage section daily production operations to meet Fab delivery requirements
Develop and optimize manufacturing processes by designing and conducting analysis programs, applying knowledge of product design and fabrication, and implementing strategies to improve efficiency, reduce costs, and enhance product quality.