Global Program Management: Independently lead and coordinate global Best Cost Country and localization projects from initial planning to successful factory implementation.
Lead package engineering development for Substrate-Based Power Modules, Flip-Chip, Multi-Chip Modules (MCM), and System-in-Package (SiP) architectures targeting AI acceleration and data center applications.
Support TLA/CCIA implementation including site readiness, installation, positioning, commissioning, system verification, joint debugging, trial runs, acceptance, go-live, handover, and post-go-live stabilization
Support daily production issues at test floor and wafer probe. This includes low yield analysis and disposition, and setup failure debug/analysis and resolution (both hardware and software)
Support daily production issues at test floor and wafer probe. This includes low yield analysis and disposition, and setup failure debug/analysis and resolution (both hardware and software)